JPH0226636Y2 - - Google Patents
Info
- Publication number
- JPH0226636Y2 JPH0226636Y2 JP6963085U JP6963085U JPH0226636Y2 JP H0226636 Y2 JPH0226636 Y2 JP H0226636Y2 JP 6963085 U JP6963085 U JP 6963085U JP 6963085 U JP6963085 U JP 6963085U JP H0226636 Y2 JPH0226636 Y2 JP H0226636Y2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- line
- substrate
- mark
- cutting pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005520 cutting process Methods 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 12
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
Landscapes
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6963085U JPH0226636Y2 (US07488766-20090210-C00029.png) | 1985-05-10 | 1985-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6963085U JPH0226636Y2 (US07488766-20090210-C00029.png) | 1985-05-10 | 1985-05-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61184697U JPS61184697U (US07488766-20090210-C00029.png) | 1986-11-18 |
| JPH0226636Y2 true JPH0226636Y2 (US07488766-20090210-C00029.png) | 1990-07-19 |
Family
ID=30605485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6963085U Expired JPH0226636Y2 (US07488766-20090210-C00029.png) | 1985-05-10 | 1985-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226636Y2 (US07488766-20090210-C00029.png) |
-
1985
- 1985-05-10 JP JP6963085U patent/JPH0226636Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61184697U (US07488766-20090210-C00029.png) | 1986-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH02143544A (ja) | 目合せ用バーニヤパターンを備えた半導体装置 | |
| JPH0226636Y2 (US07488766-20090210-C00029.png) | ||
| JPS61170032A (ja) | 集積回路のマスク位置合せ用アライメントマ−ク | |
| JPS60163110A (ja) | 位置合わせ装置 | |
| EP0337170A1 (en) | Web center-locating device | |
| JPS5983167A (ja) | 多層印刷の位置合わせ方法 | |
| JPS6219856A (ja) | パタ−ン被形成基板の位置合わせ方法 | |
| JPS63311798A (ja) | 位置合せマ−ク | |
| JP2765949B2 (ja) | 薄膜パターンのアライメント方法 | |
| JP2505743B2 (ja) | 電子装置用基板およびこの電子装置用基板への厚膜素子形成方法 | |
| JPH06120335A (ja) | 半導体ウェーハのダイシング装置 | |
| JPH0244287Y2 (US07488766-20090210-C00029.png) | ||
| JPH02111562A (ja) | グレーズドセラミック基板 | |
| KR200184218Y1 (ko) | 불량 칩들의 위치를 가리키는 차트를 구비한 볼 그리드어레이 기판 | |
| JPH0266994A (ja) | 厚膜印刷基板 | |
| JPS62177923A (ja) | アライメント精度評価方法 | |
| JPH0952227A (ja) | 切削方法 | |
| KR0122197Y1 (ko) | 하이브리드 집적회로저항의 트리밍 위치 식별장치 | |
| JPH0244288Y2 (US07488766-20090210-C00029.png) | ||
| JPS58118020A (ja) | 薄膜磁気ヘツドの加工方法 | |
| JPS6292886A (ja) | 表示板 | |
| JPH0218080A (ja) | 立体面への印刷方法 | |
| JPS63311735A (ja) | アライメント精度用ドツトバ−ニア | |
| JP2982932B2 (ja) | 金型倣い加工用モデルの位置決め構造、および金型倣い加工用モデルの位置決め構造の製造方法、および金型倣い加工用モデルの位置決め方法 | |
| JPH0720707B2 (ja) | 熱印字ヘッド |
