JPH0225428B2 - - Google Patents

Info

Publication number
JPH0225428B2
JPH0225428B2 JP16494484A JP16494484A JPH0225428B2 JP H0225428 B2 JPH0225428 B2 JP H0225428B2 JP 16494484 A JP16494484 A JP 16494484A JP 16494484 A JP16494484 A JP 16494484A JP H0225428 B2 JPH0225428 B2 JP H0225428B2
Authority
JP
Japan
Prior art keywords
sputtering
current
sputter
gas
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16494484A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6144178A (ja
Inventor
Kenji Furuta
Susumu Myagawa
Satoru Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16494484A priority Critical patent/JPS6144178A/ja
Publication of JPS6144178A publication Critical patent/JPS6144178A/ja
Publication of JPH0225428B2 publication Critical patent/JPH0225428B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP16494484A 1984-08-08 1984-08-08 スパツタ電流安定方法 Granted JPS6144178A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16494484A JPS6144178A (ja) 1984-08-08 1984-08-08 スパツタ電流安定方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16494484A JPS6144178A (ja) 1984-08-08 1984-08-08 スパツタ電流安定方法

Publications (2)

Publication Number Publication Date
JPS6144178A JPS6144178A (ja) 1986-03-03
JPH0225428B2 true JPH0225428B2 (Direct) 1990-06-04

Family

ID=15802814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16494484A Granted JPS6144178A (ja) 1984-08-08 1984-08-08 スパツタ電流安定方法

Country Status (1)

Country Link
JP (1) JPS6144178A (Direct)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742583B2 (ja) * 1986-05-23 1995-05-10 日本電信電話株式会社 薄膜形成装置

Also Published As

Publication number Publication date
JPS6144178A (ja) 1986-03-03

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