JPS6144178A - スパツタ電流安定方法 - Google Patents
スパツタ電流安定方法Info
- Publication number
- JPS6144178A JPS6144178A JP16494484A JP16494484A JPS6144178A JP S6144178 A JPS6144178 A JP S6144178A JP 16494484 A JP16494484 A JP 16494484A JP 16494484 A JP16494484 A JP 16494484A JP S6144178 A JPS6144178 A JP S6144178A
- Authority
- JP
- Japan
- Prior art keywords
- sputtering
- electric current
- internal pressure
- ammeter
- vessel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16494484A JPS6144178A (ja) | 1984-08-08 | 1984-08-08 | スパツタ電流安定方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16494484A JPS6144178A (ja) | 1984-08-08 | 1984-08-08 | スパツタ電流安定方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6144178A true JPS6144178A (ja) | 1986-03-03 |
| JPH0225428B2 JPH0225428B2 (Direct) | 1990-06-04 |
Family
ID=15802814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16494484A Granted JPS6144178A (ja) | 1984-08-08 | 1984-08-08 | スパツタ電流安定方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144178A (Direct) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62274065A (ja) * | 1986-05-23 | 1987-11-28 | Nippon Telegr & Teleph Corp <Ntt> | 薄膜形成装置 |
-
1984
- 1984-08-08 JP JP16494484A patent/JPS6144178A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62274065A (ja) * | 1986-05-23 | 1987-11-28 | Nippon Telegr & Teleph Corp <Ntt> | 薄膜形成装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0225428B2 (Direct) | 1990-06-04 |
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