JPH02249242A - チツプボンデイングの位置合せ方法 - Google Patents

チツプボンデイングの位置合せ方法

Info

Publication number
JPH02249242A
JPH02249242A JP63260449A JP26044988A JPH02249242A JP H02249242 A JPH02249242 A JP H02249242A JP 63260449 A JP63260449 A JP 63260449A JP 26044988 A JP26044988 A JP 26044988A JP H02249242 A JPH02249242 A JP H02249242A
Authority
JP
Japan
Prior art keywords
chip
substrate
board
positioning table
bonding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63260449A
Other languages
English (en)
Japanese (ja)
Other versions
JPH039621B2 (cg-RX-API-DMAC10.html
Inventor
Noboru Fujino
昇 藤野
Seiichi Chiba
誠一 千葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP63260449A priority Critical patent/JPH02249242A/ja
Publication of JPH02249242A publication Critical patent/JPH02249242A/ja
Publication of JPH039621B2 publication Critical patent/JPH039621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07178—
    • H10W72/07251—
    • H10W72/20—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP63260449A 1988-10-18 1988-10-18 チツプボンデイングの位置合せ方法 Granted JPH02249242A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63260449A JPH02249242A (ja) 1988-10-18 1988-10-18 チツプボンデイングの位置合せ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63260449A JPH02249242A (ja) 1988-10-18 1988-10-18 チツプボンデイングの位置合せ方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP56031619A Division JPS57147245A (en) 1981-03-05 1981-03-05 Positioning method and device for chip bonding

Publications (2)

Publication Number Publication Date
JPH02249242A true JPH02249242A (ja) 1990-10-05
JPH039621B2 JPH039621B2 (cg-RX-API-DMAC10.html) 1991-02-08

Family

ID=17348093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63260449A Granted JPH02249242A (ja) 1988-10-18 1988-10-18 チツプボンデイングの位置合せ方法

Country Status (1)

Country Link
JP (1) JPH02249242A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077028A (ja) * 1993-06-16 1995-01-10 Shibuya Kogyo Co Ltd 半導体位置合せ方法
JP2007173801A (ja) * 2005-12-22 2007-07-05 Unaxis Internatl Trading Ltd フリップチップを基板に取り付ける方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077028A (ja) * 1993-06-16 1995-01-10 Shibuya Kogyo Co Ltd 半導体位置合せ方法
JP2007173801A (ja) * 2005-12-22 2007-07-05 Unaxis Internatl Trading Ltd フリップチップを基板に取り付ける方法

Also Published As

Publication number Publication date
JPH039621B2 (cg-RX-API-DMAC10.html) 1991-02-08

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