JPH039621B2 - - Google Patents
Info
- Publication number
- JPH039621B2 JPH039621B2 JP63260449A JP26044988A JPH039621B2 JP H039621 B2 JPH039621 B2 JP H039621B2 JP 63260449 A JP63260449 A JP 63260449A JP 26044988 A JP26044988 A JP 26044988A JP H039621 B2 JPH039621 B2 JP H039621B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- substrate
- positioning table
- board
- bonding tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07178—
-
- H10W72/07251—
-
- H10W72/20—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63260449A JPH02249242A (ja) | 1988-10-18 | 1988-10-18 | チツプボンデイングの位置合せ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63260449A JPH02249242A (ja) | 1988-10-18 | 1988-10-18 | チツプボンデイングの位置合せ方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56031619A Division JPS57147245A (en) | 1981-03-05 | 1981-03-05 | Positioning method and device for chip bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02249242A JPH02249242A (ja) | 1990-10-05 |
| JPH039621B2 true JPH039621B2 (cg-RX-API-DMAC10.html) | 1991-02-08 |
Family
ID=17348093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63260449A Granted JPH02249242A (ja) | 1988-10-18 | 1988-10-18 | チツプボンデイングの位置合せ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02249242A (cg-RX-API-DMAC10.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2780000B2 (ja) * | 1993-06-16 | 1998-07-23 | 澁谷工業株式会社 | 半導体位置合せ装置 |
| JP2007173801A (ja) * | 2005-12-22 | 2007-07-05 | Unaxis Internatl Trading Ltd | フリップチップを基板に取り付ける方法 |
-
1988
- 1988-10-18 JP JP63260449A patent/JPH02249242A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02249242A (ja) | 1990-10-05 |
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