JPH0223031B2 - - Google Patents

Info

Publication number
JPH0223031B2
JPH0223031B2 JP57133113A JP13311382A JPH0223031B2 JP H0223031 B2 JPH0223031 B2 JP H0223031B2 JP 57133113 A JP57133113 A JP 57133113A JP 13311382 A JP13311382 A JP 13311382A JP H0223031 B2 JPH0223031 B2 JP H0223031B2
Authority
JP
Japan
Prior art keywords
internal wiring
chip carrier
semiconductor chip
ceramic
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57133113A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5923548A (ja
Inventor
Tetsushi Wakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57133113A priority Critical patent/JPS5923548A/ja
Priority to EP83401542A priority patent/EP0100727B1/en
Priority to DE8383401542T priority patent/DE3378091D1/de
Priority to IE1822/83A priority patent/IE54676B1/en
Publication of JPS5923548A publication Critical patent/JPS5923548A/ja
Publication of JPH0223031B2 publication Critical patent/JPH0223031B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/635—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H10W70/682—
    • H10W70/685—
    • H10W72/5449—
    • H10W90/754—

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP57133113A 1982-07-30 1982-07-30 半導体装置 Granted JPS5923548A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP57133113A JPS5923548A (ja) 1982-07-30 1982-07-30 半導体装置
EP83401542A EP0100727B1 (en) 1982-07-30 1983-07-27 Semiconductor device comprising a ceramic base
DE8383401542T DE3378091D1 (en) 1982-07-30 1983-07-27 Semiconductor device comprising a ceramic base
IE1822/83A IE54676B1 (en) 1982-07-30 1983-07-29 Semiconductor device comprising a ceramic base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57133113A JPS5923548A (ja) 1982-07-30 1982-07-30 半導体装置

Publications (2)

Publication Number Publication Date
JPS5923548A JPS5923548A (ja) 1984-02-07
JPH0223031B2 true JPH0223031B2 (index.php) 1990-05-22

Family

ID=15097105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57133113A Granted JPS5923548A (ja) 1982-07-30 1982-07-30 半導体装置

Country Status (4)

Country Link
EP (1) EP0100727B1 (index.php)
JP (1) JPS5923548A (index.php)
DE (1) DE3378091D1 (index.php)
IE (1) IE54676B1 (index.php)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0756887B2 (ja) * 1988-04-04 1995-06-14 株式会社日立製作所 半導体パッケージ及びそれを用いたコンピュータ
JP3112949B2 (ja) * 1994-09-23 2000-11-27 シーメンス エヌ フェー ポリマースタッドグリッドアレイ
CN103811434A (zh) * 2014-02-26 2014-05-21 中国兵器工业集团第二一四研究所苏州研发中心 一种ltcc无引线封装

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2296988A1 (fr) * 1974-12-31 1976-07-30 Ibm France Perfectionnement aux procedes de fabrication d'un module de circuits multicouches en ceramique
JPS53119675A (en) * 1977-03-28 1978-10-19 Fujitsu Ltd Mounting structure of lsi
DE2938567C2 (de) * 1979-09-24 1982-04-29 Siemens AG, 1000 Berlin und 8000 München Gehäuse für hochintegrierte Schaltkreise
JPS5651846A (en) * 1979-10-04 1981-05-09 Fujitsu Ltd Ic package
JPS57134847U (index.php) * 1981-02-16 1982-08-23
JPS598361A (ja) * 1982-07-06 1984-01-17 Nec Corp 半導体集積回路装置の容器

Also Published As

Publication number Publication date
EP0100727B1 (en) 1988-09-21
IE831822L (en) 1984-01-30
DE3378091D1 (en) 1988-10-27
EP0100727A2 (en) 1984-02-15
IE54676B1 (en) 1990-01-03
EP0100727A3 (en) 1985-08-14
JPS5923548A (ja) 1984-02-07

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