IE54676B1 - Semiconductor device comprising a ceramic base - Google Patents

Semiconductor device comprising a ceramic base

Info

Publication number
IE54676B1
IE54676B1 IE1822/83A IE182283A IE54676B1 IE 54676 B1 IE54676 B1 IE 54676B1 IE 1822/83 A IE1822/83 A IE 1822/83A IE 182283 A IE182283 A IE 182283A IE 54676 B1 IE54676 B1 IE 54676B1
Authority
IE
Ireland
Prior art keywords
semiconductor device
ceramic base
soldering pads
pads
holes
Prior art date
Application number
IE1822/83A
Other languages
English (en)
Other versions
IE831822L (en
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of IE831822L publication Critical patent/IE831822L/xx
Publication of IE54676B1 publication Critical patent/IE54676B1/en

Links

Classifications

    • H10W70/635—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H10W70/682—
    • H10W70/685—
    • H10W72/5449—
    • H10W90/754—

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
IE1822/83A 1982-07-30 1983-07-29 Semiconductor device comprising a ceramic base IE54676B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57133113A JPS5923548A (ja) 1982-07-30 1982-07-30 半導体装置

Publications (2)

Publication Number Publication Date
IE831822L IE831822L (en) 1984-01-30
IE54676B1 true IE54676B1 (en) 1990-01-03

Family

ID=15097105

Family Applications (1)

Application Number Title Priority Date Filing Date
IE1822/83A IE54676B1 (en) 1982-07-30 1983-07-29 Semiconductor device comprising a ceramic base

Country Status (4)

Country Link
EP (1) EP0100727B1 (index.php)
JP (1) JPS5923548A (index.php)
DE (1) DE3378091D1 (index.php)
IE (1) IE54676B1 (index.php)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0756887B2 (ja) * 1988-04-04 1995-06-14 株式会社日立製作所 半導体パッケージ及びそれを用いたコンピュータ
JP3112949B2 (ja) * 1994-09-23 2000-11-27 シーメンス エヌ フェー ポリマースタッドグリッドアレイ
CN103811434A (zh) * 2014-02-26 2014-05-21 中国兵器工业集团第二一四研究所苏州研发中心 一种ltcc无引线封装

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2296988A1 (fr) * 1974-12-31 1976-07-30 Ibm France Perfectionnement aux procedes de fabrication d'un module de circuits multicouches en ceramique
JPS53119675A (en) * 1977-03-28 1978-10-19 Fujitsu Ltd Mounting structure of lsi
DE2938567C2 (de) * 1979-09-24 1982-04-29 Siemens AG, 1000 Berlin und 8000 München Gehäuse für hochintegrierte Schaltkreise
JPS5651846A (en) * 1979-10-04 1981-05-09 Fujitsu Ltd Ic package
JPS57134847U (index.php) * 1981-02-16 1982-08-23
JPS598361A (ja) * 1982-07-06 1984-01-17 Nec Corp 半導体集積回路装置の容器

Also Published As

Publication number Publication date
EP0100727B1 (en) 1988-09-21
IE831822L (en) 1984-01-30
DE3378091D1 (en) 1988-10-27
EP0100727A2 (en) 1984-02-15
EP0100727A3 (en) 1985-08-14
JPS5923548A (ja) 1984-02-07
JPH0223031B2 (index.php) 1990-05-22

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Legal Events

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