JPH0221654B2 - - Google Patents
Info
- Publication number
- JPH0221654B2 JPH0221654B2 JP57039550A JP3955082A JPH0221654B2 JP H0221654 B2 JPH0221654 B2 JP H0221654B2 JP 57039550 A JP57039550 A JP 57039550A JP 3955082 A JP3955082 A JP 3955082A JP H0221654 B2 JPH0221654 B2 JP H0221654B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- protrusion
- recess
- semiconductor device
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W76/157—
-
- H10W90/756—
Landscapes
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57039550A JPS58157152A (ja) | 1982-03-15 | 1982-03-15 | ガラス封止型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57039550A JPS58157152A (ja) | 1982-03-15 | 1982-03-15 | ガラス封止型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58157152A JPS58157152A (ja) | 1983-09-19 |
| JPH0221654B2 true JPH0221654B2 (OSRAM) | 1990-05-15 |
Family
ID=12556161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57039550A Granted JPS58157152A (ja) | 1982-03-15 | 1982-03-15 | ガラス封止型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58157152A (OSRAM) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5773937U (OSRAM) * | 1980-10-24 | 1982-05-07 |
-
1982
- 1982-03-15 JP JP57039550A patent/JPS58157152A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58157152A (ja) | 1983-09-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6348183B2 (OSRAM) | ||
| JPH0719872B2 (ja) | 半導体装置 | |
| JPH0221654B2 (OSRAM) | ||
| KR100248147B1 (ko) | 반도체패키지 및 그 실장용 소켓 | |
| JPS59141648U (ja) | 半導体装置用保護素子 | |
| JPS59110146A (ja) | パツケ−ジ形モジユ−ルの外部引出し端子 | |
| JP3316494B2 (ja) | パッケージ型ハイブリット集積回路装置 | |
| JPS58125344U (ja) | 過負荷溶断形抵抗器 | |
| JPS62183546A (ja) | 半導体装置 | |
| JP2691420B2 (ja) | チップ形コンデンサ | |
| JPH01162246U (OSRAM) | ||
| JPS6120780Y2 (OSRAM) | ||
| JPH03233960A (ja) | 樹脂封止型半導体装置 | |
| JPS623898Y2 (OSRAM) | ||
| JPS63244655A (ja) | 樹脂封止型集積回路装置 | |
| JPH0462942A (ja) | 半導体装置 | |
| JPS58140641U (ja) | ガラス封止形半導体パツケ−ジ | |
| JPH0533536U (ja) | 半導体素子 | |
| JPS60105258A (ja) | 樹脂封止型半導体装置 | |
| JPH0563056U (ja) | 2端子面実装型樹脂封止半導体装置 | |
| JPH07153899A (ja) | 半導体装置 | |
| JPH01276656A (ja) | 樹脂封止型半導体装置 | |
| JPS6327039A (ja) | 半導体装置 | |
| JPS63300541A (ja) | 半導体装置パッケ−ジ | |
| JPS58135945U (ja) | ガラス封止形半導体パツケ−ジ |