JPH0221140B2 - - Google Patents

Info

Publication number
JPH0221140B2
JPH0221140B2 JP56174744A JP17474481A JPH0221140B2 JP H0221140 B2 JPH0221140 B2 JP H0221140B2 JP 56174744 A JP56174744 A JP 56174744A JP 17474481 A JP17474481 A JP 17474481A JP H0221140 B2 JPH0221140 B2 JP H0221140B2
Authority
JP
Japan
Prior art keywords
cover
cover body
brazing material
sealing
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56174744A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5875850A (ja
Inventor
Shozo Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP56174744A priority Critical patent/JPS5875850A/ja
Publication of JPS5875850A publication Critical patent/JPS5875850A/ja
Publication of JPH0221140B2 publication Critical patent/JPH0221140B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
JP56174744A 1981-10-31 1981-10-31 Ｉｃパツケ−ジのシ−ル用カバ−及びその成形方法 Granted JPS5875850A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56174744A JPS5875850A (ja) 1981-10-31 1981-10-31 Ｉｃパツケ−ジのシ−ル用カバ−及びその成形方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56174744A JPS5875850A (ja) 1981-10-31 1981-10-31 Ｉｃパツケ−ジのシ−ル用カバ−及びその成形方法

Publications (2)

Publication Number Publication Date
JPS5875850A JPS5875850A (ja) 1983-05-07
JPH0221140B2 true JPH0221140B2 (OSRAM) 1990-05-11

Family

ID=15983916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56174744A Granted JPS5875850A (ja) 1981-10-31 1981-10-31 Ｉｃパツケ−ジのシ−ル用カバ−及びその成形方法

Country Status (1)

Country Link
JP (1) JPS5875850A (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02235361A (ja) * 1989-03-09 1990-09-18 Sumitomo Metal Mining Co Ltd ハーメチックシールカバー及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS524841Y2 (OSRAM) * 1972-10-26 1977-02-01
JPS5432312A (en) * 1977-08-16 1979-03-09 Toshiba Corp Magnetic data write apparatus
JPS5546558A (en) * 1978-09-29 1980-04-01 Fujitsu Ltd Metallic cover plate for semiconductor package

Also Published As

Publication number Publication date
JPS5875850A (ja) 1983-05-07

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