JPH0220158B2 - - Google Patents
Info
- Publication number
- JPH0220158B2 JPH0220158B2 JP57172163A JP17216382A JPH0220158B2 JP H0220158 B2 JPH0220158 B2 JP H0220158B2 JP 57172163 A JP57172163 A JP 57172163A JP 17216382 A JP17216382 A JP 17216382A JP H0220158 B2 JPH0220158 B2 JP H0220158B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- power supply
- partition wall
- integrated circuit
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005192 partition Methods 0.000 claims description 25
- 230000000903 blocking effect Effects 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000002265 prevention Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 4
- 230000003321 amplification Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Amplifiers (AREA)
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Microwave Amplifiers (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57172163A JPS5961998A (ja) | 1982-09-30 | 1982-09-30 | 集積回路基板収納筐体構造 |
EP83305846A EP0105717B1 (en) | 1982-09-30 | 1983-09-28 | An electronic device comprising integrated circuits |
DE8383305846T DE3370269D1 (en) | 1982-09-30 | 1983-09-28 | An electronic device comprising integrated circuits |
US06/830,485 US4685034A (en) | 1982-09-30 | 1986-02-18 | Electric device comprising integrated circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57172163A JPS5961998A (ja) | 1982-09-30 | 1982-09-30 | 集積回路基板収納筐体構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5961998A JPS5961998A (ja) | 1984-04-09 |
JPH0220158B2 true JPH0220158B2 (US06168776-20010102-C00028.png) | 1990-05-08 |
Family
ID=15936738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57172163A Granted JPS5961998A (ja) | 1982-09-30 | 1982-09-30 | 集積回路基板収納筐体構造 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4685034A (US06168776-20010102-C00028.png) |
EP (1) | EP0105717B1 (US06168776-20010102-C00028.png) |
JP (1) | JPS5961998A (US06168776-20010102-C00028.png) |
DE (1) | DE3370269D1 (US06168776-20010102-C00028.png) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NO851937L (no) * | 1984-05-24 | 1985-11-25 | Siemens Ag | Flat kapsel for radioapparat. |
DE3790062C2 (US06168776-20010102-C00028.png) * | 1986-02-06 | 1992-01-23 | Fujitsu Ltd., Kawasaki, Kanagawa, Jp | |
GB8721496D0 (en) * | 1987-09-12 | 1987-10-21 | Rainford Racks Ltd | Line protection device |
US4864077A (en) * | 1988-06-10 | 1989-09-05 | Teradyne, Inc. | Shielded enclosure |
US4884171A (en) * | 1988-12-15 | 1989-11-28 | Howell Instruments | Electromagnetic interference shielding device for a portable aircraft engine tester |
JPH036099A (ja) * | 1989-06-02 | 1991-01-11 | Canon Inc | 電子機器の実装構造 |
FR2655508B1 (fr) * | 1989-12-01 | 1996-04-19 | Sept Doloy Sa | Procede de realisation de boitiers a plusieurs compartiments pour encapsulation de circuits microelectroniques. |
US5043534A (en) * | 1990-07-02 | 1991-08-27 | Olin Corporation | Metal electronic package having improved resistance to electromagnetic interference |
US5005283A (en) * | 1990-09-19 | 1991-04-09 | Rockwell International Corporation | Method of manufacturing an E/M shielded RF circuit board |
US5233500A (en) * | 1992-06-01 | 1993-08-03 | Conductus, Inc. | Package for cascaded microwave devices |
US5267122A (en) * | 1992-06-15 | 1993-11-30 | Alcatel Network Systems, Inc. | Optical network unit |
US6137688A (en) | 1996-12-31 | 2000-10-24 | Intel Corporation | Apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply |
GB2329746B (en) * | 1997-09-25 | 1999-10-27 | Paul Roberts Plc | Modular electronic system |
US6157547A (en) * | 1998-05-28 | 2000-12-05 | 3Com Corporation | Electromagnetic interference shielding filter apparatus and method |
JP2000036682A (ja) * | 1998-07-16 | 2000-02-02 | Alps Electric Co Ltd | 周波数変換装置 |
US6093888A (en) * | 1999-02-17 | 2000-07-25 | Nokia Networks Oy | Apparatus, and associated method, for shielding emi-generative components of an electrical device |
FI116757B (fi) * | 2000-04-28 | 2006-02-15 | Vacon Oyj | Sovitelma taajuusmuuttajassa |
JP2004364170A (ja) * | 2003-06-06 | 2004-12-24 | Toshiba Corp | ケーブルモデムモジュール装置及び送受信装置 |
JP4830917B2 (ja) * | 2007-03-07 | 2011-12-07 | 三菱電機株式会社 | 高周波モジュール装置及びこれを用いた送受信モジュール装置 |
JP7365810B2 (ja) * | 2019-08-01 | 2023-10-20 | 三菱電機株式会社 | 電子機器筐体 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54108553A (en) * | 1978-02-15 | 1979-08-25 | Fujitsu Ltd | Assembling structure of microwave band circuit |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE47909C (de) * | E. zerr in Weifsenburg i. Eis., am Mittelthor | Herstellung von Reliefs auf photochemischem Wege | ||
US2296678A (en) * | 1940-06-25 | 1942-09-22 | Rca Corp | Ultra high frequency device |
US2963577A (en) * | 1959-08-10 | 1960-12-06 | Motorola Inc | Radio apparatus |
DE1280355B (de) * | 1961-09-29 | 1968-10-17 | Siemens Ag | Plattenbaugruppe fuer Geraete und Anlagen der elektrischen Nachrichtentechnik |
US3638148A (en) * | 1970-06-25 | 1972-01-25 | Collins Radio Co | Lid interaction protected shield enclosed dielectric mounted microstrip |
FR2142838B1 (US06168776-20010102-C00028.png) * | 1971-06-25 | 1974-04-05 | Cit Alcatel | |
US3721746A (en) * | 1971-10-01 | 1973-03-20 | Motorola Inc | Shielding techniques for r.f. circuitry |
DE2629053C2 (de) * | 1976-06-29 | 1982-06-03 | Siemens AG, 1000 Berlin und 8000 München | Gehäuse zur Aufnahme von gedruckten Leiterplatten und Substraten |
GB2029645B (en) * | 1978-08-07 | 1982-07-14 | Mitsumi Electric Co Ltd | High-frequency circuit device |
US4370700A (en) * | 1980-06-03 | 1983-01-25 | Motorola Inc. | RF Package including RF shielding for a multiple PC board |
US4426773A (en) * | 1981-05-15 | 1984-01-24 | General Electric Ceramics, Inc. | Array of electronic packaging substrates |
JPS57193094A (en) * | 1981-05-18 | 1982-11-27 | Matsushita Electric Ind Co Ltd | Electronic circuit part and method of mounting same |
-
1982
- 1982-09-30 JP JP57172163A patent/JPS5961998A/ja active Granted
-
1983
- 1983-09-28 EP EP83305846A patent/EP0105717B1/en not_active Expired
- 1983-09-28 DE DE8383305846T patent/DE3370269D1/de not_active Expired
-
1986
- 1986-02-18 US US06/830,485 patent/US4685034A/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54108553A (en) * | 1978-02-15 | 1979-08-25 | Fujitsu Ltd | Assembling structure of microwave band circuit |
Also Published As
Publication number | Publication date |
---|---|
US4685034A (en) | 1987-08-04 |
EP0105717A3 (en) | 1984-11-07 |
JPS5961998A (ja) | 1984-04-09 |
DE3370269D1 (en) | 1987-04-16 |
EP0105717A2 (en) | 1984-04-18 |
EP0105717B1 (en) | 1987-03-11 |
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