JPH0219970Y2 - - Google Patents

Info

Publication number
JPH0219970Y2
JPH0219970Y2 JP1985124206U JP12420685U JPH0219970Y2 JP H0219970 Y2 JPH0219970 Y2 JP H0219970Y2 JP 1985124206 U JP1985124206 U JP 1985124206U JP 12420685 U JP12420685 U JP 12420685U JP H0219970 Y2 JPH0219970 Y2 JP H0219970Y2
Authority
JP
Japan
Prior art keywords
solder
lead electrode
liquid crystal
crystal display
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985124206U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6232536U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985124206U priority Critical patent/JPH0219970Y2/ja
Publication of JPS6232536U publication Critical patent/JPS6232536U/ja
Application granted granted Critical
Publication of JPH0219970Y2 publication Critical patent/JPH0219970Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Wire Bonding (AREA)
JP1985124206U 1985-08-13 1985-08-13 Expired JPH0219970Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985124206U JPH0219970Y2 (enrdf_load_stackoverflow) 1985-08-13 1985-08-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985124206U JPH0219970Y2 (enrdf_load_stackoverflow) 1985-08-13 1985-08-13

Publications (2)

Publication Number Publication Date
JPS6232536U JPS6232536U (enrdf_load_stackoverflow) 1987-02-26
JPH0219970Y2 true JPH0219970Y2 (enrdf_load_stackoverflow) 1990-05-31

Family

ID=31016005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985124206U Expired JPH0219970Y2 (enrdf_load_stackoverflow) 1985-08-13 1985-08-13

Country Status (1)

Country Link
JP (1) JPH0219970Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6232536U (enrdf_load_stackoverflow) 1987-02-26

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