JPH02185049A - 半導体素子 - Google Patents

半導体素子

Info

Publication number
JPH02185049A
JPH02185049A JP1005581A JP558189A JPH02185049A JP H02185049 A JPH02185049 A JP H02185049A JP 1005581 A JP1005581 A JP 1005581A JP 558189 A JP558189 A JP 558189A JP H02185049 A JPH02185049 A JP H02185049A
Authority
JP
Japan
Prior art keywords
image recognition
recognition mark
picture
recognizing
sign
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1005581A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0563098B2 (enExample
Inventor
Takaaki Yokoyama
隆昭 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1005581A priority Critical patent/JPH02185049A/ja
Publication of JPH02185049A publication Critical patent/JPH02185049A/ja
Publication of JPH0563098B2 publication Critical patent/JPH0563098B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Image Processing (AREA)
  • Wire Bonding (AREA)
  • Image Analysis (AREA)
JP1005581A 1989-01-12 1989-01-12 半導体素子 Granted JPH02185049A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1005581A JPH02185049A (ja) 1989-01-12 1989-01-12 半導体素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1005581A JPH02185049A (ja) 1989-01-12 1989-01-12 半導体素子

Publications (2)

Publication Number Publication Date
JPH02185049A true JPH02185049A (ja) 1990-07-19
JPH0563098B2 JPH0563098B2 (enExample) 1993-09-09

Family

ID=11615204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1005581A Granted JPH02185049A (ja) 1989-01-12 1989-01-12 半導体素子

Country Status (1)

Country Link
JP (1) JPH02185049A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015204375A (ja) 2014-04-14 2015-11-16 株式会社ジェイテクト 半導体装置
JP2015204374A (ja) 2014-04-14 2015-11-16 株式会社ジェイテクト 半導体装置

Also Published As

Publication number Publication date
JPH0563098B2 (enExample) 1993-09-09

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