JPH021629B2 - - Google Patents

Info

Publication number
JPH021629B2
JPH021629B2 JP3827682A JP3827682A JPH021629B2 JP H021629 B2 JPH021629 B2 JP H021629B2 JP 3827682 A JP3827682 A JP 3827682A JP 3827682 A JP3827682 A JP 3827682A JP H021629 B2 JPH021629 B2 JP H021629B2
Authority
JP
Japan
Prior art keywords
processed
chipping
hard
grinding
machining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3827682A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58155157A (ja
Inventor
Takashi Myatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP3827682A priority Critical patent/JPS58155157A/ja
Publication of JPS58155157A publication Critical patent/JPS58155157A/ja
Publication of JPH021629B2 publication Critical patent/JPH021629B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP3827682A 1982-03-11 1982-03-11 硬脆材料におけるチツピング防止加工方法 Granted JPS58155157A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3827682A JPS58155157A (ja) 1982-03-11 1982-03-11 硬脆材料におけるチツピング防止加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3827682A JPS58155157A (ja) 1982-03-11 1982-03-11 硬脆材料におけるチツピング防止加工方法

Publications (2)

Publication Number Publication Date
JPS58155157A JPS58155157A (ja) 1983-09-14
JPH021629B2 true JPH021629B2 (enrdf_load_stackoverflow) 1990-01-12

Family

ID=12520781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3827682A Granted JPS58155157A (ja) 1982-03-11 1982-03-11 硬脆材料におけるチツピング防止加工方法

Country Status (1)

Country Link
JP (1) JPS58155157A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4918229B2 (ja) * 2005-05-31 2012-04-18 信越半導体株式会社 貼り合わせウエーハの製造方法
JP5023113B2 (ja) * 2009-07-31 2012-09-12 ブリヂストンプラントエンジニアリング株式会社 薄板ガラスの加工装置
JP5653234B2 (ja) * 2011-01-21 2015-01-14 株式会社ディスコ 硬質基板の研削方法

Also Published As

Publication number Publication date
JPS58155157A (ja) 1983-09-14

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