JPS58155157A - 硬脆材料におけるチツピング防止加工方法 - Google Patents
硬脆材料におけるチツピング防止加工方法Info
- Publication number
- JPS58155157A JPS58155157A JP3827682A JP3827682A JPS58155157A JP S58155157 A JPS58155157 A JP S58155157A JP 3827682 A JP3827682 A JP 3827682A JP 3827682 A JP3827682 A JP 3827682A JP S58155157 A JPS58155157 A JP S58155157A
- Authority
- JP
- Japan
- Prior art keywords
- chipping
- brittle material
- machined
- grinding
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title abstract description 15
- 238000003754 machining Methods 0.000 title abstract description 7
- 239000006061 abrasive grain Substances 0.000 claims description 7
- 238000003672 processing method Methods 0.000 claims description 7
- 230000002265 prevention Effects 0.000 claims description 5
- 230000000873 masking effect Effects 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3827682A JPS58155157A (ja) | 1982-03-11 | 1982-03-11 | 硬脆材料におけるチツピング防止加工方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3827682A JPS58155157A (ja) | 1982-03-11 | 1982-03-11 | 硬脆材料におけるチツピング防止加工方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58155157A true JPS58155157A (ja) | 1983-09-14 |
| JPH021629B2 JPH021629B2 (enrdf_load_stackoverflow) | 1990-01-12 |
Family
ID=12520781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3827682A Granted JPS58155157A (ja) | 1982-03-11 | 1982-03-11 | 硬脆材料におけるチツピング防止加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58155157A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339302A (ja) * | 2005-05-31 | 2006-12-14 | Shin Etsu Handotai Co Ltd | 貼り合わせウエーハの製造方法及び貼り合わせウエーハの外周研削装置 |
| JP2011032124A (ja) * | 2009-07-31 | 2011-02-17 | Bridgestone Plant Engineering Co Ltd | 薄板ガラスの加工装置 |
| JP2012148390A (ja) * | 2011-01-21 | 2012-08-09 | Disco Corp | 硬質基板の研削方法 |
-
1982
- 1982-03-11 JP JP3827682A patent/JPS58155157A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339302A (ja) * | 2005-05-31 | 2006-12-14 | Shin Etsu Handotai Co Ltd | 貼り合わせウエーハの製造方法及び貼り合わせウエーハの外周研削装置 |
| JP2011032124A (ja) * | 2009-07-31 | 2011-02-17 | Bridgestone Plant Engineering Co Ltd | 薄板ガラスの加工装置 |
| JP2012148390A (ja) * | 2011-01-21 | 2012-08-09 | Disco Corp | 硬質基板の研削方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH021629B2 (enrdf_load_stackoverflow) | 1990-01-12 |
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