JPH021629B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a chipping prevention processing method for hard and brittle materials that prevents chipping that occurs when grinding hard and brittle materials.

[Technical background of the invention and its problems]

Generally, when processing hard and brittle materials such as semiconductor materials such as ceramics such as silicon nitride, glass, and silicon (recess machining, hole machining, etc.), grinding using a highly efficient grindstone is used. As shown in FIG. 1, this grinding process has a problem in that the edges of the processed portion b of the hard and brittle material a are likely to chip due to concentrated stress, ie, so-called chipping c, c. Such chipping c, c
If this occurs, the dimensions, shape and accuracy of the processed portion b will be impaired and the required function of the part will be lost. For this reason, in the field of grinding, how to prevent the occurrence of chipping c, c has become an issue. However, it has been considered that the occurrence of chippings c and c is unavoidable, and conventionally, the following chipping prevention processing method has been adopted.

That is, techniques are being used to reduce the cutting depth of the grindstone, reduce the feed of the grindstone, or to avoid grinding and instead use lapping, polishing, or jetting using free abrasive grains.

However, according to such chipping prevention machining method technology, machining methods that reduce the cutting depth and feed of the grinding wheel are forced to reduce machining efficiency, and machining methods that use loose abrasive grains prevent the occurrence of chipping. However, even if it were possible to do so, there was a problem in that the efficiency of machining the other side similarly decreased, and none of them were effective.

[Purpose of the invention]

This invention was made in view of the above circumstances, and its purpose is to provide a chipping prevention processing method for hard and brittle materials that can grind hard and brittle materials with high efficiency without causing chipping. It is about providing.

[Summary of the invention]

In this invention, after masking the surface of a hard brittle material excluding the part to be processed, the part to be processed is micro-removed by processing with free abrasive grains, and then the part to be processed is removed through the micro-removed part. By performing the grinding process, it is possible to perform the grinding process without having edges that cause chipping, and to achieve highly efficient machining without causing chipping.

[Embodiments of the invention]

Hereinafter, the processing method of the present invention will be explained by applying it to, for example, processing a concave portion of a glass plate.

In FIG. 2, reference numeral 1 denotes a plate made of a hard and brittle material made of plate-shaped glass, and on one side of this plate 1, a rectangular workpiece portion 1a shown by a solid chain line is set. Then, this processed portion 1a is processed into a recess. When performing this processing,
First, a mask member 2 made of, for example, aluminum or an elastic material is adhered to the side of the plate 1 excluding the processed portion 1a, and the plate 1 is masked as shown in FIG. 3a. After this, this plate 1
The upper part to be processed 1a is subjected to micro-removal processing such as dry (liquid) honing using free abrasive grains to an extent that no chipping occurs, for example 100 μm, as shown in FIG. 3b, and rough cutting is performed. During such machining, if the edge 5 of the workpiece 1a protrudes outward from the end face of the mask member 2 and is exposed as shown in FIG. 6, when the next grinding process is performed, the edge 5 However, when processing using free abrasive grains as described above, the surface of the processed part 1a is processed using the mask member 2 as a shielding part. As shown in FIG. 3b, the end face of the mask member 2 and the end face of the processed portion 1a are flush with each other, that is, micro-removal processing without producing an edge 5 is performed. Note that 3 is an injection nozzle. Thereafter, the part to be processed 1a is semi-finished into a concave shape through the micro-removed part 1b as shown in FIG. During this semi-finishing, the edges 5 are not exposed as in the previous processing using free abrasive grains. Then, by performing a final finishing process such as wrapping, a concave portion having the required depth and dimensional accuracy as shown in FIG. 4 is obtained.

Therefore, the grinding process, which is said to be likely to cause chipping, is performed through the micro-removal part cut in advance by the jetting process, so there is no exposure of the edge 5, which can cause stress concentration. The required grinding process can be achieved in this state.

Therefore, using highly efficient grinding process,
The plate 1 can be processed with high efficiency without causing chipping on the edges 5.

Incidentally, in the above-mentioned embodiment, jet machining was employed for machining using free abrasive grains, but the same effect may be achieved by using machining such as lapping or etching.

Further, in the embodiments described above, the present invention is applied to machining recesses, but it goes without saying that it can also be applied to machining holes. Note that FIGS. 5a, b, and c show the processing procedure for drilling holes. However, Fig. 5 a, b, c
Components that are the same as those in the embodiment described above are given the same numbers and their explanations are omitted.

〔Effect of the invention〕

As explained above, according to the present invention, after masking the surface of the hard and brittle material excluding the part to be machined and performing micro-removal processing on the part to be processed using free abrasive grains, the highly efficient grinding process Since the part to be machined is machined through the removed part, the required grinding process can be achieved without edges where stress is concentrated.

Therefore, it is possible to process hard and brittle materials by grinding with high efficiency without causing chipping.

[Brief explanation of drawings]

Figure 1 is an explanatory diagram pointing out and explaining the occurrence of chipping during grinding in conventional hard and brittle processed materials.
The figure is a perspective view showing a hard and brittle processing material according to an embodiment of the present invention, and Figures 3a, b, and c are explanatory diagrams illustrating a chipping prevention processing method according to an embodiment of the present invention along the process progress, Figure 4 is a perspective view showing the hard and brittle processed material after the processing method is completed, Figure 5a,
b and c are explanatory diagrams showing another embodiment in which the present invention is applied to drilling processing, together with the progress of the method, and FIG. 6 is a sectional view showing exposure of an edge. 1... Plate (hard brittle processing material), 1a... Processed part, 2... Mask member, 3... Spray nozzle (processing using free abrasive grains), 4... Grindstone (grinding process),
5...Etsuji.

Claims (1)

[Claims] 1. A masking step in which a mask member is attached to a surface of a hard brittle material having a to-be-processed portion other than the to-be-processed portion, and a jetting process in which free abrasive grains are injected onto the to-be-processed portion to perform micro-removal processing after the masking step. and a grinding process of grinding the micro-removed part after the injection process.