JPH02154482A - 樹脂封止型半導体発光装置 - Google Patents

樹脂封止型半導体発光装置

Info

Publication number
JPH02154482A
JPH02154482A JP63309301A JP30930188A JPH02154482A JP H02154482 A JPH02154482 A JP H02154482A JP 63309301 A JP63309301 A JP 63309301A JP 30930188 A JP30930188 A JP 30930188A JP H02154482 A JPH02154482 A JP H02154482A
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
mounting surface
lead
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63309301A
Other languages
English (en)
Inventor
Yoshinari Kimura
木村　義成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63309301A priority Critical patent/JPH02154482A/ja
Publication of JPH02154482A publication Critical patent/JPH02154482A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は樹脂封止型半導体発光装置に関し、特に発光素
子のマウント面側の裏面電極を導電性接着剤でマウント
リードの素子マウント面に接着接続するｍ造の樹脂封止
型半導体発光装置に関する。
〔従来の技術〕
従来、この種の樹脂封止型半導体発光装置は、第２図（
ａ）、（ｂ）に示すように、発光素子２Ａのマウン）・
面側の裏面電極２３Ａが導電性接着剤の銀ペースト３に
よってマウントリード１の素子マウントｉｆＩ］］−１
に固着され、発光素子５への表面側の電極がホンディン
ク線５で他のリード４に接続され、全体がエポキシ樹脂
６で封止される構造となっていた。
発光素子２Ａのマウント状態は、第２図（ｂ）に示すよ
うに、銀ペースト３が発光素子２Ａのマウント面側にｐ
−ｎ接合部２１に接触しない範囲に塗布され、平坦な裏
面電極２３Ａと平坦な素子マウント面］１とが接着接続
するようになっていた。
また、マウント材の導電性接着剤は、光出力の通電劣化
に影響を与えるマウント歪を抑えるため、上述したよう
に、銀ペーストが多く用いられ上述した従来の樹脂封止
型半導体発光装置は、発光素子２Ａのマウント面側に銀
ペースト３か１゛）ｎ接合部２１に接触しない範囲で塗
布され、平坦な裏面電極２３Ａと平坦な素子マウント面
１１とが接着接続する構造となっているので、銀ペース
ト３の塗布量が多量の場合、発光素子２Ａの側面に露出
しているｐ−ｎ接合部２】に接して短絡不良が発生し、
反対に塗布量か少量の場合は、はんだ付は実装時等の熱
的１機械的ス）・レス或は、実動作時の熱的ストレス等
の影響によってマウント面の密着性が低下し、発光素子
２Ａのはく能が生じ、その結果接続不良が発生するなめ
、塗布量管理は厳しく、従って発光素子２Ａのマウント
作業が困難になるという欠点がある。
本発明の目的は、銀ペーストの塗布量管理が緩和されて
マウント作業が容易となり、かつマウント面の接着強度
を向上することかできる樹脂￥１止型半導体発光装置を
提供することにある。
〔課題を解決するための手段〕
本発明の樹脂封止型半導体発光装置は、素子マウント作
業を備えたマウン１へリードと、ラウンｌ−面側に深さ
がｐ−ｎ結合部までの深さより浅く形成された複数の？
Ｉｋ部と前記マウント面に形成された裏面電極とを備え
た発光素子と、この発光素子の裏面電極を前記マウント
リードの素子７９７１〜面に接着接続してこの発光素子
を固定する導電性接着剤とを有している。
〔実施例〕
次に、本発明の実施例について図面を参照して説明する
。
第１図＜ａ、）、（ｂ）はそれぞれ本発明の一実施例を
示す断面図及び部分拡大断面図である。
この実施例は、素子マウント面〕１を備えたラウンｌ−
リート］と、マウント面側に深さがｐ−ｎ接合部２１ま
での深さより浅く形成された複数の溝部２２とマウン１
へ而に形成された裏面電極２３とを備えた発光素子２と
、この発光素子２の裏面電極２３とマウン）〜リート］
の素子マウン）〜面】１に接着接続して発光素子２を固
定する導電性接着材の銀ペースト３と、マウントリード
１と対をなすリード４と、発光素子２の表面側の電極を
リード４に接続するボンディング線５と、マウン）〜リ
ード］及びリード４の一部を除き他の部分全体を覆って
封止するエポキシ樹脂６とを有する構造となっている。
銀ペースト３は発光素子２のマウント面側にト）ｎ接合
部２１に接触しない範囲で塗布されるが、発光素子２の
側面の塗布量を少なめにすることにより、銀ペースト３
がｐ−ｎ接合部２１に接触するのを防止することかでき
、しかも鋼部２２に銀ペースト３が入り込むので接着表
面積が大きくなり、接着強度を高めることができる。
従って銀ペースト４の塗布量管理が緩和され、塗布作業
が容易になる。
なお、この発光素子２は、ます、マウン）・面に凹状の
溝部２２を選択エツチンクにより形成し、次に蒸着法に
よって凸部先端に裏面電極２３を形成することで容易に
製造可能である。
〔発明の効果〕
以上説明したように本発明は、発光素子のマウント面に
複数の溝部を形成することにより、銀ペーストとの接着
表面積を大きくすることができるのてマウン）・面の接
着強度を増すことができ、また、銀ペース１〜の側面の
塗布量を少なめにすることでｐ−１１接合と銀ペースト
との接触を防止でき、従って銀ペース１への塗布量管理
が緩和され、塗布作業が容易になるという効果がある。
【図面の簡単な説明】
第１図＜ａ）、（ｂ）はそれぞれ本発明の一実施例を示
す断面図及び部分拡大断面図、第２図（ａ）、（ｂ）は
それぞれ従来の樹脂封止型半導体発光装置の一例を示す
断面図及び部分拡大断面図である。 ］・・・マウントリード、２，２Ａ・・発光素子、３・
・・銀ペース１へ、４・・リード、５・・・ボンディン
グ線、６・・・エポキシ樹脂、］トトラマウント、２１
・・・ｐ−ｎ接合部、２２・・・溝部、２３．２３Ａ・
・・裏面電極。

Claims (1)

    【特許請求の範囲】
  1. 素子マウント面を備えたマウントリードと、マウント面
    側に深さがｐ−ｎ結合部までの深さより浅く形成された
    複数の溝部と前記マウント面に形成された裏面電極とを
    備えた発光素子と、この発光素子の裏面電極を前記マウ
    ントリードの素子マウント面に接着接続してこの発光素
    子を固定する導電性接着剤とを有することを特徴とする
    樹脂封止型半導体発光装置。
JP63309301A 1988-12-06 1988-12-06 樹脂封止型半導体発光装置 Pending JPH02154482A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63309301A JPH02154482A (ja) 1988-12-06 1988-12-06 樹脂封止型半導体発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63309301A JPH02154482A (ja) 1988-12-06 1988-12-06 樹脂封止型半導体発光装置

Publications (1)

Publication Number Publication Date
JPH02154482A true JPH02154482A (ja) 1990-06-13

Family

ID=17991359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63309301A Pending JPH02154482A (ja) 1988-12-06 1988-12-06 樹脂封止型半導体発光装置

Country Status (1)

Country Link
JP (1) JPH02154482A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789820A (en) * 1996-02-28 1998-08-04 Nec Corporation Method for manufacturing heat radiating resin-molded semiconductor device
US7038245B2 (en) 2002-03-14 2006-05-02 Kabushiki Kaisha Toshiba Semiconductor light emitting device having angled side surface
JP5351267B2 (ja) * 2009-07-24 2013-11-27 パナソニック株式会社 半導体部品、半導体ウェハ部品、半導体部品の製造方法、及び、接合構造体の製造方法
US20150176779A1 (en) * 2013-12-20 2015-06-25 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting system, electronic component mounting method, and electronic component mounting machine

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789820A (en) * 1996-02-28 1998-08-04 Nec Corporation Method for manufacturing heat radiating resin-molded semiconductor device
US7038245B2 (en) 2002-03-14 2006-05-02 Kabushiki Kaisha Toshiba Semiconductor light emitting device having angled side surface
US7329903B2 (en) 2002-03-14 2008-02-12 Kabushiki Kaisha Toshiba Semiconductor light emitting element having three side surfaces inclined to connect the top and bottom surfaces of the transparent substrate
JP5351267B2 (ja) * 2009-07-24 2013-11-27 パナソニック株式会社 半導体部品、半導体ウェハ部品、半導体部品の製造方法、及び、接合構造体の製造方法
US20150176779A1 (en) * 2013-12-20 2015-06-25 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting system, electronic component mounting method, and electronic component mounting machine
US9227387B2 (en) * 2013-12-20 2016-01-05 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting system, electronic component mounting method, and electronic component mounting machine
US9572295B2 (en) 2013-12-20 2017-02-14 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting system, electronic component mounting method, and electronic component mounting machine

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