JPH0214780B2 - - Google Patents

Info

Publication number
JPH0214780B2
JPH0214780B2 JP57221406A JP22140682A JPH0214780B2 JP H0214780 B2 JPH0214780 B2 JP H0214780B2 JP 57221406 A JP57221406 A JP 57221406A JP 22140682 A JP22140682 A JP 22140682A JP H0214780 B2 JPH0214780 B2 JP H0214780B2
Authority
JP
Japan
Prior art keywords
bonding
semiconductor element
tool
bonding tool
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57221406A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59111337A (ja
Inventor
Minoru Hirai
Kenzo Hatada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57221406A priority Critical patent/JPS59111337A/ja
Publication of JPS59111337A publication Critical patent/JPS59111337A/ja
Publication of JPH0214780B2 publication Critical patent/JPH0214780B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/077—
    • H10W72/701—

Landscapes

  • Wire Bonding (AREA)
JP57221406A 1982-12-16 1982-12-16 ボンデイング方法 Granted JPS59111337A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57221406A JPS59111337A (ja) 1982-12-16 1982-12-16 ボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57221406A JPS59111337A (ja) 1982-12-16 1982-12-16 ボンデイング方法

Publications (2)

Publication Number Publication Date
JPS59111337A JPS59111337A (ja) 1984-06-27
JPH0214780B2 true JPH0214780B2 (cg-RX-API-DMAC10.html) 1990-04-10

Family

ID=16766243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57221406A Granted JPS59111337A (ja) 1982-12-16 1982-12-16 ボンデイング方法

Country Status (1)

Country Link
JP (1) JPS59111337A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004062842A1 (en) * 2003-01-03 2004-07-29 Nanopierce Technologies, Inc. Ultrasonic bonding of electrical devices
CN113658875B (zh) * 2021-08-18 2022-06-21 深圳市振华微电子有限公司 一种中小功率混合集成电路的组装方法

Also Published As

Publication number Publication date
JPS59111337A (ja) 1984-06-27

Similar Documents

Publication Publication Date Title
EP1374297B1 (en) Flip chip interconnection using no-clean flux
KR20040055734A (ko) 플립 칩 방법
US6543109B1 (en) Method of manufacturing a surface acoustic wave apparatus
JPH0214780B2 (cg-RX-API-DMAC10.html)
KR100358683B1 (ko) 전자 부품의 제조 방법
JP3412672B2 (ja) 半導体装置、およびこの半導体装置の製造方法
JPH03218645A (ja) 半導体装置の実装方法
JP2002184810A (ja) ボンディング方法、ボンディング装置および実装基板
JP2005230845A (ja) 超音波接合装置および電子デバイスの製造方法
JPH05218136A (ja) フリップチップ・ボンディング方法
JPH1022328A (ja) ボンディング方法及びその装置
JPH0695519B2 (ja) バンプ形成方法
JP2812304B2 (ja) フリップチップ型半導体装置のリペア方法
JP2000216198A (ja) 半導体装置およびその製造方法
JP2661439B2 (ja) ボンディング方法およびその治具
JP2581474B2 (ja) Ｔａｂリードの接合方法
JP4295517B2 (ja) 半導体チップの実装構造および半導体チップの実装方法
JPH0666361B2 (ja) ボンディング装置及びボンディング方法
JPH09260818A (ja) 電子部品の実装方法及びその構造
JP2001351948A (ja) 半導体チップ実装回路基板及び回路基板への半導体チップの実装方法
JP2591600B2 (ja) ボンディング方法
JP3915325B2 (ja) 半導体装置の製造方法
JPH0574875A (ja) Ｔａｂインナーリードの接合方法
JPS63244635A (ja) ボンデイング装置
JPH10199935A (ja) ワークの実装方法