JPH02120833U - - Google Patents
Info
- Publication number
- JPH02120833U JPH02120833U JP2971489U JP2971489U JPH02120833U JP H02120833 U JPH02120833 U JP H02120833U JP 2971489 U JP2971489 U JP 2971489U JP 2971489 U JP2971489 U JP 2971489U JP H02120833 U JPH02120833 U JP H02120833U
- Authority
- JP
- Japan
- Prior art keywords
- processing apparatus
- plasma
- sample
- plasma processing
- sample holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003989 dielectric material Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2971489U JPH02120833U (enExample) | 1989-03-17 | 1989-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2971489U JPH02120833U (enExample) | 1989-03-17 | 1989-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02120833U true JPH02120833U (enExample) | 1990-09-28 |
Family
ID=31254161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2971489U Pending JPH02120833U (enExample) | 1989-03-17 | 1989-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02120833U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021108378A (ja) * | 2015-09-04 | 2021-07-29 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 周期的かつ選択的な材料の除去及びエッチングのための処理チャンバ |
-
1989
- 1989-03-17 JP JP2971489U patent/JPH02120833U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021108378A (ja) * | 2015-09-04 | 2021-07-29 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 周期的かつ選択的な材料の除去及びエッチングのための処理チャンバ |
| US11728139B2 (en) | 2015-09-04 | 2023-08-15 | Applied Materials, Inc. | Process chamber for cyclic and selective material removal and etching |
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