JPH0211029B2 - - Google Patents
Info
- Publication number
- JPH0211029B2 JPH0211029B2 JP11927384A JP11927384A JPH0211029B2 JP H0211029 B2 JPH0211029 B2 JP H0211029B2 JP 11927384 A JP11927384 A JP 11927384A JP 11927384 A JP11927384 A JP 11927384A JP H0211029 B2 JPH0211029 B2 JP H0211029B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal plate
- insulating layer
- groove
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11927384A JPS60262636A (ja) | 1984-06-11 | 1984-06-11 | 金属ベ−ス積層板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11927384A JPS60262636A (ja) | 1984-06-11 | 1984-06-11 | 金属ベ−ス積層板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60262636A JPS60262636A (ja) | 1985-12-26 |
| JPH0211029B2 true JPH0211029B2 (enrdf_load_stackoverflow) | 1990-03-12 |
Family
ID=14757281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11927384A Granted JPS60262636A (ja) | 1984-06-11 | 1984-06-11 | 金属ベ−ス積層板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60262636A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0691303B2 (ja) * | 1987-11-30 | 1994-11-14 | イビデン株式会社 | 電子部品搭載プリント配線板装置 |
| JP2005039112A (ja) * | 2003-07-17 | 2005-02-10 | Denki Kagaku Kogyo Kk | 金属ベース回路基板 |
| EP1615267B1 (en) | 2003-04-15 | 2016-01-13 | Denki Kagaku Kogyo Kabushiki Kaisha | Hybrid integrated circuit comprising a metal-base circuit board and its manufacturing method |
| DE102019208108A1 (de) * | 2019-06-04 | 2020-12-10 | Zf Friedrichshafen Ag | Substratstruktur in einem leistungsmodul und herstellungsverfahren dafür |
-
1984
- 1984-06-11 JP JP11927384A patent/JPS60262636A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60262636A (ja) | 1985-12-26 |
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