JPH0160546B2 - - Google Patents

Info

Publication number
JPH0160546B2
JPH0160546B2 JP1850581A JP1850581A JPH0160546B2 JP H0160546 B2 JPH0160546 B2 JP H0160546B2 JP 1850581 A JP1850581 A JP 1850581A JP 1850581 A JP1850581 A JP 1850581A JP H0160546 B2 JPH0160546 B2 JP H0160546B2
Authority
JP
Japan
Prior art keywords
evaporation
vapor flow
thin film
evaporation source
partition wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1850581A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57134555A (en
Inventor
Akira Nahara
Makoto Nagao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Priority to JP1850581A priority Critical patent/JPS57134555A/ja
Priority to DE19823204337 priority patent/DE3204337A1/de
Publication of JPS57134555A publication Critical patent/JPS57134555A/ja
Publication of JPH0160546B2 publication Critical patent/JPH0160546B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP1850581A 1981-02-10 1981-02-10 Method and device for forming thin film Granted JPS57134555A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1850581A JPS57134555A (en) 1981-02-10 1981-02-10 Method and device for forming thin film
DE19823204337 DE3204337A1 (de) 1981-02-10 1982-02-09 Verfahren und vorrichtung zum bilden eines duennen films

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1850581A JPS57134555A (en) 1981-02-10 1981-02-10 Method and device for forming thin film

Publications (2)

Publication Number Publication Date
JPS57134555A JPS57134555A (en) 1982-08-19
JPH0160546B2 true JPH0160546B2 (enrdf_load_stackoverflow) 1989-12-22

Family

ID=11973474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1850581A Granted JPS57134555A (en) 1981-02-10 1981-02-10 Method and device for forming thin film

Country Status (1)

Country Link
JP (1) JPS57134555A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003035925A1 (en) * 2001-10-26 2003-05-01 Matsushita Electric Works, Ltd. Device and method for vacuum deposition, and organic electroluminescent element provided by the device and the method
JP2004047452A (ja) * 2002-05-17 2004-02-12 Semiconductor Energy Lab Co Ltd 製造装置
JP2013067867A (ja) * 2012-12-13 2013-04-18 Semiconductor Energy Lab Co Ltd 容器

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3590269T (de) * 1984-06-12 1986-06-05 Kievskij politechničeskij institut imeni 50-letija Velikoj Oktjabrskoj Socialističeskoj Revoljucii, Kiev Verfahren zum Aufbringen von dünnen Schichten durch Vakuumaufdampfen
JPS6143275U (ja) * 1984-08-17 1986-03-20 三洋電機株式会社 結晶成長装置
JPS62124271A (ja) * 1985-11-25 1987-06-05 Mitsubishi Electric Corp 溶融物質の蒸気噴出装置
JPS6389660A (ja) * 1986-10-01 1988-04-20 Konica Corp 蛍光体蒸着装置
JP2701477B2 (ja) * 1989-09-19 1998-01-21 株式会社ユアサコーポレーション 二酸化マンガン正極の製造法
JP2701476B2 (ja) * 1989-09-19 1998-01-21 株式会社ユアサコーポレーション リチウム負極の製造法
JP2008204835A (ja) * 2007-02-21 2008-09-04 Matsushita Electric Ind Co Ltd 電気化学素子とその電極の前処理方法および製造方法、前処理装置
JP5620747B2 (ja) * 2010-08-19 2014-11-05 三菱伸銅株式会社 真空蒸着装置
CN112981443B (zh) * 2021-02-22 2022-04-19 吉林大学 一种表面沉积纳米银薄膜的泡沫镍、制备方法及其应用
WO2024022579A1 (en) * 2022-07-26 2024-02-01 Applied Materials, Inc. Evaporation source, material deposition apparatus, and method of depositing material on a substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003035925A1 (en) * 2001-10-26 2003-05-01 Matsushita Electric Works, Ltd. Device and method for vacuum deposition, and organic electroluminescent element provided by the device and the method
KR100958682B1 (ko) * 2001-10-26 2010-05-20 파나소닉 전공 주식회사 진공증착장치, 진공증착방법 및 이들로부터 얻어지는 유기el 소자
JP2004047452A (ja) * 2002-05-17 2004-02-12 Semiconductor Energy Lab Co Ltd 製造装置
JP2013067867A (ja) * 2012-12-13 2013-04-18 Semiconductor Energy Lab Co Ltd 容器

Also Published As

Publication number Publication date
JPS57134555A (en) 1982-08-19

Similar Documents

Publication Publication Date Title
JPH0160546B2 (enrdf_load_stackoverflow)
JPS63137159A (ja) 結晶性金属薄膜の形成方法
JPH0152472B2 (enrdf_load_stackoverflow)
US20240162021A1 (en) Sputtering Apparatus
JP2570560Y2 (ja) 電子ビーム蒸発源
JP3335375B2 (ja) 電子ビーム加熱式蒸着装置および蒸着方法
JPS6320303B2 (enrdf_load_stackoverflow)
JPS61195968A (ja) 合金蒸着膜の製造方法
JPS58100672A (ja) 薄膜形成法及びその装置
JP2002053955A (ja) イオン化成膜装置及びイオン化成膜方法
JPS5948450B2 (ja) 磁気記録媒体の製造方法
KR930001231B1 (ko) 다중극 자장억류 원리를 이용한 대용량 이온플레이팅 방법 및 그장치
JPH06111322A (ja) 蒸着装置
JPH062202Y2 (ja) 電子銃装置
JPH06111295A (ja) 蒸着装置
JPH01205066A (ja) 真空成膜装置
JPS6067667A (ja) スパッタ蒸着装置
JPS6289861A (ja) 薄膜衝撃蒸着方法とその装置
JPH05140741A (ja) スパツタ装置
JPH0734925Y2 (ja) イオンビ−ムスパツタリング装置
JPH01247570A (ja) ビームスパッタ法による多成分物質膜の形成方法
JPS6230876A (ja) 対向タ−ゲツト式スパツタ装置
JPS6152359A (ja) サ−マルシ−ルドの金属蒸着膜形成方法
JPH0754147A (ja) ダイナミックミキシング装置
JPS6334226B2 (enrdf_load_stackoverflow)