JPS57134555A - Method and device for forming thin film - Google Patents

Method and device for forming thin film

Info

Publication number
JPS57134555A
JPS57134555A JP1850581A JP1850581A JPS57134555A JP S57134555 A JPS57134555 A JP S57134555A JP 1850581 A JP1850581 A JP 1850581A JP 1850581 A JP1850581 A JP 1850581A JP S57134555 A JPS57134555 A JP S57134555A
Authority
JP
Japan
Prior art keywords
vapor
substrate
thin film
deposited
vapor flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1850581A
Other languages
English (en)
Other versions
JPH0160546B2 (ja
Inventor
Akira Nahara
Makoto Nagao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Priority to JP1850581A priority Critical patent/JPS57134555A/ja
Priority to DE19823204337 priority patent/DE3204337A1/de
Publication of JPS57134555A publication Critical patent/JPS57134555A/ja
Publication of JPH0160546B2 publication Critical patent/JPH0160546B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP1850581A 1981-02-10 1981-02-10 Method and device for forming thin film Granted JPS57134555A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1850581A JPS57134555A (en) 1981-02-10 1981-02-10 Method and device for forming thin film
DE19823204337 DE3204337A1 (de) 1981-02-10 1982-02-09 Verfahren und vorrichtung zum bilden eines duennen films

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1850581A JPS57134555A (en) 1981-02-10 1981-02-10 Method and device for forming thin film

Publications (2)

Publication Number Publication Date
JPS57134555A true JPS57134555A (en) 1982-08-19
JPH0160546B2 JPH0160546B2 (ja) 1989-12-22

Family

ID=11973474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1850581A Granted JPS57134555A (en) 1981-02-10 1981-02-10 Method and device for forming thin film

Country Status (1)

Country Link
JP (1) JPS57134555A (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6143275U (ja) * 1984-08-17 1986-03-20 三洋電機株式会社 結晶成長装置
JPS62124271A (ja) * 1985-11-25 1987-06-05 Mitsubishi Electric Corp 溶融物質の蒸気噴出装置
US4700660A (en) * 1984-06-12 1987-10-20 Kievsky Politekhnichesky Institut Evaporator for depositing films in a vacuum
JPS6389660A (ja) * 1986-10-01 1988-04-20 Konica Corp 蛍光体蒸着装置
JPH03105854A (ja) * 1989-09-19 1991-05-02 Yuasa Battery Co Ltd リチウム負極の製造法
JPH03105853A (ja) * 1989-09-19 1991-05-02 Yuasa Battery Co Ltd 二酸化マンガン正極の製造法
JP2008204835A (ja) * 2007-02-21 2008-09-04 Matsushita Electric Ind Co Ltd 電気化学素子とその電極の前処理方法および製造方法、前処理装置
JP2012041604A (ja) * 2010-08-19 2012-03-01 Mitsubishi Shindoh Co Ltd 真空蒸着装置
CN112981443A (zh) * 2021-02-22 2021-06-18 吉林大学 一种表面沉积纳米银薄膜的泡沫镍、制备方法及其应用
WO2024022579A1 (en) * 2022-07-26 2024-02-01 Applied Materials, Inc. Evaporation source, material deposition apparatus, and method of depositing material on a substrate

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI264473B (en) * 2001-10-26 2006-10-21 Matsushita Electric Works Ltd Vacuum deposition device and vacuum deposition method
JP4954434B2 (ja) * 2002-05-17 2012-06-13 株式会社半導体エネルギー研究所 製造装置
JP2013067867A (ja) * 2012-12-13 2013-04-18 Semiconductor Energy Lab Co Ltd 容器

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4700660A (en) * 1984-06-12 1987-10-20 Kievsky Politekhnichesky Institut Evaporator for depositing films in a vacuum
JPS6143275U (ja) * 1984-08-17 1986-03-20 三洋電機株式会社 結晶成長装置
JPH031485Y2 (ja) * 1984-08-17 1991-01-17
JPH0416545B2 (ja) * 1985-11-25 1992-03-24 Mitsubishi Electric Corp
JPS62124271A (ja) * 1985-11-25 1987-06-05 Mitsubishi Electric Corp 溶融物質の蒸気噴出装置
JPH0581671B2 (ja) * 1986-10-01 1993-11-15 Konishiroku Photo Ind
JPS6389660A (ja) * 1986-10-01 1988-04-20 Konica Corp 蛍光体蒸着装置
JPH03105853A (ja) * 1989-09-19 1991-05-02 Yuasa Battery Co Ltd 二酸化マンガン正極の製造法
JPH03105854A (ja) * 1989-09-19 1991-05-02 Yuasa Battery Co Ltd リチウム負極の製造法
JP2701477B2 (ja) * 1989-09-19 1998-01-21 株式会社ユアサコーポレーション 二酸化マンガン正極の製造法
JP2701476B2 (ja) * 1989-09-19 1998-01-21 株式会社ユアサコーポレーション リチウム負極の製造法
JP2008204835A (ja) * 2007-02-21 2008-09-04 Matsushita Electric Ind Co Ltd 電気化学素子とその電極の前処理方法および製造方法、前処理装置
JP2012041604A (ja) * 2010-08-19 2012-03-01 Mitsubishi Shindoh Co Ltd 真空蒸着装置
CN102373421A (zh) * 2010-08-19 2012-03-14 三菱伸铜株式会社 真空蒸镀装置
CN112981443A (zh) * 2021-02-22 2021-06-18 吉林大学 一种表面沉积纳米银薄膜的泡沫镍、制备方法及其应用
CN112981443B (zh) * 2021-02-22 2022-04-19 吉林大学 一种表面沉积纳米银薄膜的泡沫镍、制备方法及其应用
WO2024022579A1 (en) * 2022-07-26 2024-02-01 Applied Materials, Inc. Evaporation source, material deposition apparatus, and method of depositing material on a substrate

Also Published As

Publication number Publication date
JPH0160546B2 (ja) 1989-12-22

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