JPH0159736B2 - - Google Patents
Info
- Publication number
- JPH0159736B2 JPH0159736B2 JP56077694A JP7769481A JPH0159736B2 JP H0159736 B2 JPH0159736 B2 JP H0159736B2 JP 56077694 A JP56077694 A JP 56077694A JP 7769481 A JP7769481 A JP 7769481A JP H0159736 B2 JPH0159736 B2 JP H0159736B2
- Authority
- JP
- Japan
- Prior art keywords
- resist
- film
- photoresist film
- positive photoresist
- resist film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7769481A JPS57193037A (en) | 1981-05-22 | 1981-05-22 | Forming and treating method for pattern by lifting-off method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7769481A JPS57193037A (en) | 1981-05-22 | 1981-05-22 | Forming and treating method for pattern by lifting-off method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57193037A JPS57193037A (en) | 1982-11-27 |
| JPH0159736B2 true JPH0159736B2 (cs) | 1989-12-19 |
Family
ID=13640994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7769481A Granted JPS57193037A (en) | 1981-05-22 | 1981-05-22 | Forming and treating method for pattern by lifting-off method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57193037A (cs) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6025897B2 (ja) * | 1976-10-08 | 1985-06-20 | 松下電器産業株式会社 | 半導体装置の製造方法 |
| JPS5394184A (en) * | 1977-01-28 | 1978-08-17 | Fujitsu Ltd | Pattern forming method by lift-off |
-
1981
- 1981-05-22 JP JP7769481A patent/JPS57193037A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57193037A (en) | 1982-11-27 |
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