JPH0156883B2 - - Google Patents

Info

Publication number
JPH0156883B2
JPH0156883B2 JP55091045A JP9104580A JPH0156883B2 JP H0156883 B2 JPH0156883 B2 JP H0156883B2 JP 55091045 A JP55091045 A JP 55091045A JP 9104580 A JP9104580 A JP 9104580A JP H0156883 B2 JPH0156883 B2 JP H0156883B2
Authority
JP
Japan
Prior art keywords
ingot
suction
cutting
movable pedestal
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55091045A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5715908A (en
Inventor
Satoru Kitsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Kikai Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Kikai Kogyo KK filed Critical Fujikoshi Kikai Kogyo KK
Priority to JP9104580A priority Critical patent/JPS5715908A/ja
Publication of JPS5715908A publication Critical patent/JPS5715908A/ja
Publication of JPH0156883B2 publication Critical patent/JPH0156883B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP9104580A 1980-07-03 1980-07-03 Cutting method and its device Granted JPS5715908A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9104580A JPS5715908A (en) 1980-07-03 1980-07-03 Cutting method and its device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9104580A JPS5715908A (en) 1980-07-03 1980-07-03 Cutting method and its device

Publications (2)

Publication Number Publication Date
JPS5715908A JPS5715908A (en) 1982-01-27
JPH0156883B2 true JPH0156883B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-12-01

Family

ID=14015524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9104580A Granted JPS5715908A (en) 1980-07-03 1980-07-03 Cutting method and its device

Country Status (1)

Country Link
JP (1) JPS5715908A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102042429B1 (ko) * 2019-06-27 2019-11-27 한화시스템(주) 함정의 전력 제어 시스템 및 그 방법

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821108U (ja) * 1981-07-30 1983-02-09 三菱電線工業株式会社 光ロ−タリコネクタ
JP2565961B2 (ja) * 1988-01-07 1996-12-18 株式会社東京精密 スライシングマシンのウエハ回収装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4916397A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-05-18 1974-02-13
DE2528734C3 (de) * 1975-06-27 1978-09-14 Hoechst Ag, 6000 Frankfurt Präparationsmittel für das Texturieren von Polyesterfasern
JPS52143577A (en) * 1976-05-26 1977-11-30 Hitachi Ltd Method for slicing rod-like members
JPS56129115A (en) * 1980-03-16 1981-10-09 Yasuo Ichikawa Slicing method and its device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102042429B1 (ko) * 2019-06-27 2019-11-27 한화시스템(주) 함정의 전력 제어 시스템 및 그 방법

Also Published As

Publication number Publication date
JPS5715908A (en) 1982-01-27

Similar Documents

Publication Publication Date Title
KR920004063B1 (ko) 반도체 웨이퍼 표면의 연삭 방법 및 그 장치
JP2010135436A (ja) 基板への接着テープ貼り付け装置
JPH0156883B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN110534459A (zh) 一体式减薄装置
JPH0335057B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2010074115A (ja) ワーク分離方法及び切削加工装置
JPS63174841A (ja) ダイサ−用ワ−クテ−ブル
JPS6225319Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0143459B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3599890B2 (ja) ウェハのバリ除去装置
JP2001205548A (ja) 片面研削装置および片面研削方法
JPS6032324A (ja) 半導体ウエハ乾燥装置
JPH04225256A (ja) ウェーハ把持装置
JP2003218078A (ja) ウェーハの加工装置
JPS6318069A (ja) スパツタ方法
JPH0230211Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS59187432A (ja) 回転テ−ブル
JPH045357U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH01103201A (ja) ローディング装置を備えた加工機
JP3078433U (ja) 帯鋸盤の切断片支持装置
JPS6029415Y2 (ja) レンズの面取り装置
JP3077170B2 (ja) スライシングマシンにおけるウェハーの枚葉取出し方法
JPH04348546A (ja) ダイシング装置
JPH052278Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0319740A (ja) 被加工物保持ハンドリング装置