JPH0155606B2 - - Google Patents
Info
- Publication number
- JPH0155606B2 JPH0155606B2 JP8446282A JP8446282A JPH0155606B2 JP H0155606 B2 JPH0155606 B2 JP H0155606B2 JP 8446282 A JP8446282 A JP 8446282A JP 8446282 A JP8446282 A JP 8446282A JP H0155606 B2 JPH0155606 B2 JP H0155606B2
- Authority
- JP
- Japan
- Prior art keywords
- base material
- electrode
- insulator
- piezoelectric
- piezoelectric vibrating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 56
- 239000012212 insulator Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 32
- 238000000605 extraction Methods 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 238000010897 surface acoustic wave method Methods 0.000 description 11
- 239000003990 capacitor Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 230000005284 excitation Effects 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/542—Filters comprising resonators of piezoelectric or electrostrictive material including passive elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8446282A JPS58139514A (ja) | 1982-05-18 | 1982-05-18 | チップ状圧電振動部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8446282A JPS58139514A (ja) | 1982-05-18 | 1982-05-18 | チップ状圧電振動部品の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2146182A Division JPS58138115A (ja) | 1982-02-12 | 1982-02-12 | チップ状圧電振動部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58139514A JPS58139514A (ja) | 1983-08-18 |
| JPH0155606B2 true JPH0155606B2 (US06633782-20031014-M00005.png) | 1989-11-27 |
Family
ID=13831286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8446282A Granted JPS58139514A (ja) | 1982-05-18 | 1982-05-18 | チップ状圧電振動部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58139514A (US06633782-20031014-M00005.png) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1281810C (en) * | 1984-02-20 | 1991-03-19 | Stephen P. Rogerson | Mounting of saw devices |
| JPS60192526U (ja) * | 1984-05-30 | 1985-12-20 | 株式会社村田製作所 | 表面波装置 |
| JPH0746979Y2 (ja) * | 1988-08-31 | 1995-10-25 | 株式会社村田製作所 | 圧電共振子 |
| JPH07226644A (ja) * | 1994-02-16 | 1995-08-22 | Murata Mfg Co Ltd | エネルギー閉じ込め型圧電共振子 |
| JP2000114918A (ja) * | 1998-10-05 | 2000-04-21 | Mitsubishi Electric Corp | 表面弾性波装置及びその製造方法 |
| JP4701505B2 (ja) * | 2001-01-29 | 2011-06-15 | パナソニック株式会社 | 慣性トランスデューサ |
-
1982
- 1982-05-18 JP JP8446282A patent/JPS58139514A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58139514A (ja) | 1983-08-18 |
