JPH0149022B2 - - Google Patents

Info

Publication number
JPH0149022B2
JPH0149022B2 JP5736885A JP5736885A JPH0149022B2 JP H0149022 B2 JPH0149022 B2 JP H0149022B2 JP 5736885 A JP5736885 A JP 5736885A JP 5736885 A JP5736885 A JP 5736885A JP H0149022 B2 JPH0149022 B2 JP H0149022B2
Authority
JP
Japan
Prior art keywords
plating
leads
glass
conductive wire
metal base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5736885A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61216349A (ja
Inventor
Masato Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP5736885A priority Critical patent/JPS61216349A/ja
Publication of JPS61216349A publication Critical patent/JPS61216349A/ja
Publication of JPH0149022B2 publication Critical patent/JPH0149022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5736885A 1985-03-20 1985-03-20 ガラス端子のメツキ方法 Granted JPS61216349A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5736885A JPS61216349A (ja) 1985-03-20 1985-03-20 ガラス端子のメツキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5736885A JPS61216349A (ja) 1985-03-20 1985-03-20 ガラス端子のメツキ方法

Publications (2)

Publication Number Publication Date
JPS61216349A JPS61216349A (ja) 1986-09-26
JPH0149022B2 true JPH0149022B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-10-23

Family

ID=13053643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5736885A Granted JPS61216349A (ja) 1985-03-20 1985-03-20 ガラス端子のメツキ方法

Country Status (1)

Country Link
JP (1) JPS61216349A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6980275B1 (en) 1993-09-20 2005-12-27 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4854049B2 (ja) * 2009-08-31 2012-01-11 エヌイーシー ショット コンポーネンツ株式会社 電子部品の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6980275B1 (en) 1993-09-20 2005-12-27 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device

Also Published As

Publication number Publication date
JPS61216349A (ja) 1986-09-26

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term