JPH0144035B2 - - Google Patents
Info
- Publication number
- JPH0144035B2 JPH0144035B2 JP58037782A JP3778283A JPH0144035B2 JP H0144035 B2 JPH0144035 B2 JP H0144035B2 JP 58037782 A JP58037782 A JP 58037782A JP 3778283 A JP3778283 A JP 3778283A JP H0144035 B2 JPH0144035 B2 JP H0144035B2
- Authority
- JP
- Japan
- Prior art keywords
- lands
- soldering
- land
- terminals
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 39
- 239000000919 ceramic Substances 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 13
- 239000010410 layer Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58037782A JPS59163893A (ja) | 1983-03-08 | 1983-03-08 | セラミツク配線板への部品実装構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58037782A JPS59163893A (ja) | 1983-03-08 | 1983-03-08 | セラミツク配線板への部品実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59163893A JPS59163893A (ja) | 1984-09-14 |
JPH0144035B2 true JPH0144035B2 (tr) | 1989-09-25 |
Family
ID=12507054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58037782A Granted JPS59163893A (ja) | 1983-03-08 | 1983-03-08 | セラミツク配線板への部品実装構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59163893A (tr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6183080U (tr) * | 1984-11-07 | 1986-06-02 | ||
JP5406887B2 (ja) * | 2011-06-29 | 2014-02-05 | 株式会社鷺宮製作所 | 弁装置および弁装置の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5527601A (en) * | 1978-08-17 | 1980-02-27 | Tokyo Shibaura Electric Co | Reflow soldering pattern |
-
1983
- 1983-03-08 JP JP58037782A patent/JPS59163893A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5527601A (en) * | 1978-08-17 | 1980-02-27 | Tokyo Shibaura Electric Co | Reflow soldering pattern |
Also Published As
Publication number | Publication date |
---|---|
JPS59163893A (ja) | 1984-09-14 |
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