JPH0143474B2 - - Google Patents
Info
- Publication number
- JPH0143474B2 JPH0143474B2 JP57063260A JP6326082A JPH0143474B2 JP H0143474 B2 JPH0143474 B2 JP H0143474B2 JP 57063260 A JP57063260 A JP 57063260A JP 6326082 A JP6326082 A JP 6326082A JP H0143474 B2 JPH0143474 B2 JP H0143474B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- insulating layer
- wiring conductor
- wiring board
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000010409 thin film Substances 0.000 claims description 21
- 238000005452 bending Methods 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 239000004642 Polyimide Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 description 33
- 239000010410 layer Substances 0.000 description 31
- 239000000758 substrate Substances 0.000 description 26
- 239000010408 film Substances 0.000 description 18
- 239000004973 liquid crystal related substance Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 12
- 239000011159 matrix material Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000002966 varnish Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 238000001953 recrystallisation Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 229910002482 Cu–Ni Inorganic materials 0.000 description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 239000004962 Polyamide-imide Substances 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- 229920002312 polyamide-imide Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57063260A JPS58180088A (ja) | 1982-04-15 | 1982-04-15 | 配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57063260A JPS58180088A (ja) | 1982-04-15 | 1982-04-15 | 配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58180088A JPS58180088A (ja) | 1983-10-21 |
| JPH0143474B2 true JPH0143474B2 (nl) | 1989-09-20 |
Family
ID=13224121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57063260A Granted JPS58180088A (ja) | 1982-04-15 | 1982-04-15 | 配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58180088A (nl) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160683A (ja) * | 1984-01-31 | 1985-08-22 | シャープ株式会社 | 折り曲げ可能な配線基板の製造方法 |
| DE69329542T2 (de) * | 1992-06-05 | 2001-02-08 | Mitsui Chemicals Inc | Dreidimensionale leiterplatte, elektronische bauelementanordnung unter verwendung dieser leiterplatte und herstellungsverfahren zu dieser leiterplatte |
| JPH0722721A (ja) * | 1993-06-29 | 1995-01-24 | Asahi Print Kogyo Kk | 金属ベース印刷配線板 |
| JP3613302B2 (ja) * | 1995-07-26 | 2005-01-26 | セイコーエプソン株式会社 | インクジェット式記録ヘッド |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5095775A (nl) * | 1973-12-20 | 1975-07-30 | ||
| JPS5426474A (en) * | 1977-07-29 | 1979-02-28 | Fujitsu Ltd | Apparatus for detecing position of pin |
| JPS5520096A (en) * | 1978-07-26 | 1980-02-13 | Siemens Ag | Electric filter circuit by ctd line of respective ctd elements |
-
1982
- 1982-04-15 JP JP57063260A patent/JPS58180088A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5095775A (nl) * | 1973-12-20 | 1975-07-30 | ||
| JPS5426474A (en) * | 1977-07-29 | 1979-02-28 | Fujitsu Ltd | Apparatus for detecing position of pin |
| JPS5520096A (en) * | 1978-07-26 | 1980-02-13 | Siemens Ag | Electric filter circuit by ctd line of respective ctd elements |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58180088A (ja) | 1983-10-21 |
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