JPH0142500B2 - - Google Patents

Info

Publication number
JPH0142500B2
JPH0142500B2 JP57151877A JP15187782A JPH0142500B2 JP H0142500 B2 JPH0142500 B2 JP H0142500B2 JP 57151877 A JP57151877 A JP 57151877A JP 15187782 A JP15187782 A JP 15187782A JP H0142500 B2 JPH0142500 B2 JP H0142500B2
Authority
JP
Japan
Prior art keywords
tape
layer
leads
tape material
carrier tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57151877A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5941845A (ja
Inventor
Atsushi Kusakabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JTEKT Column Systems Corp
Original Assignee
Fuji Kiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Kiko Co Ltd filed Critical Fuji Kiko Co Ltd
Priority to JP57151877A priority Critical patent/JPS5941845A/ja
Publication of JPS5941845A publication Critical patent/JPS5941845A/ja
Publication of JPH0142500B2 publication Critical patent/JPH0142500B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Wire Bonding (AREA)
JP57151877A 1982-08-31 1982-08-31 ２層式集積回路用キヤリアテ−プ、その製造方法 Granted JPS5941845A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57151877A JPS5941845A (ja) 1982-08-31 1982-08-31 ２層式集積回路用キヤリアテ−プ、その製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57151877A JPS5941845A (ja) 1982-08-31 1982-08-31 ２層式集積回路用キヤリアテ−プ、その製造方法

Publications (2)

Publication Number Publication Date
JPS5941845A JPS5941845A (ja) 1984-03-08
JPH0142500B2 true JPH0142500B2 (enExample) 1989-09-13

Family

ID=15528152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57151877A Granted JPS5941845A (ja) 1982-08-31 1982-08-31 ２層式集積回路用キヤリアテ−プ、その製造方法

Country Status (1)

Country Link
JP (1) JPS5941845A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088279B2 (ja) * 1989-10-03 1996-01-29 松下電器産業株式会社 フィルムキャリア製造用のフィルム材およびフィルムキャリアの製造方法

Also Published As

Publication number Publication date
JPS5941845A (ja) 1984-03-08

Similar Documents

Publication Publication Date Title
US5817541A (en) Methods of fabricating an HDMI decal chip scale package
US6256877B1 (en) Method for transforming a substrate with edge contacts into a ball grid array
JP2631287B2 (ja) 混成多層回路基板の製造法
US4195195A (en) Tape automated bonding test board
US4052787A (en) Method of fabricating a beam lead flexible circuit
US5953594A (en) Method of making a circuitized substrate for chip carrier structure
JP3895697B2 (ja) フレキシブル配線回路基板
JP2000058996A (ja) フレキシブルプリント配線板及びその製造方法
JPH02306690A (ja) 表面実装用配線基板の製造方法
US6207354B1 (en) Method of making an organic chip carrier package
US6110650A (en) Method of making a circuitized substrate
JPS62156847A (ja) 多層プリント配線板の製造方法
JPS60216573A (ja) フレキシブル印刷配線板の製造方法
JPS5941845A (ja) ２層式集積回路用キヤリアテ−プ、その製造方法
JP2787230B2 (ja) 電子部品塔載用基板
JP2868779B2 (ja) Ｔａｂ用テープ
JPS58134450A (ja) 半導体装置およびその製造方法
JPH0278253A (ja) 多層プラスチックチップキャリア
JP2766361B2 (ja) 半導体装置
JPH09307019A (ja) 半導体パッケージの製造方法及び半導体パッケージ
JP4137295B2 (ja) Ｃｓｐ用テープキャリアの製造方法
JP3561284B2 (ja) 半導体装置の構造
JPS6355236B2 (enExample)
JP3074667B2 (ja) チップキャリア及びその製造方法
JPS6175596A (ja) スルホール多層回路基板の製造方法