JPH0142500B2 - - Google Patents

Info

Publication number
JPH0142500B2
JPH0142500B2 JP15187782A JP15187782A JPH0142500B2 JP H0142500 B2 JPH0142500 B2 JP H0142500B2 JP 15187782 A JP15187782 A JP 15187782A JP 15187782 A JP15187782 A JP 15187782A JP H0142500 B2 JPH0142500 B2 JP H0142500B2
Authority
JP
Japan
Prior art keywords
tape
layer
leads
tape material
carrier tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15187782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5941845A (ja
Inventor
Atsushi Kusakabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JTEKT Column Systems Corp
Original Assignee
Fuji Kiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Kiko Co Ltd filed Critical Fuji Kiko Co Ltd
Priority to JP15187782A priority Critical patent/JPS5941845A/ja
Publication of JPS5941845A publication Critical patent/JPS5941845A/ja
Publication of JPH0142500B2 publication Critical patent/JPH0142500B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP15187782A 1982-08-31 1982-08-31 ２層式集積回路用キヤリアテ−プ、その製造方法 Granted JPS5941845A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15187782A JPS5941845A (ja) 1982-08-31 1982-08-31 ２層式集積回路用キヤリアテ−プ、その製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15187782A JPS5941845A (ja) 1982-08-31 1982-08-31 ２層式集積回路用キヤリアテ−プ、その製造方法

Publications (2)

Publication Number Publication Date
JPS5941845A JPS5941845A (ja) 1984-03-08
JPH0142500B2 true JPH0142500B2 (enrdf_load_stackoverflow) 1989-09-13

Family

ID=15528152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15187782A Granted JPS5941845A (ja) 1982-08-31 1982-08-31 ２層式集積回路用キヤリアテ−プ、その製造方法

Country Status (1)

Country Link
JP (1) JPS5941845A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088279B2 (ja) * 1989-10-03 1996-01-29 松下電器産業株式会社 フィルムキャリア製造用のフィルム材およびフィルムキャリアの製造方法

Also Published As

Publication number Publication date
JPS5941845A (ja) 1984-03-08

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