JPS5941845A - ２層式集積回路用キヤリアテ−プ、その製造方法 - Google Patents
２層式集積回路用キヤリアテ−プ、その製造方法Info
- Publication number
- JPS5941845A JPS5941845A JP15187782A JP15187782A JPS5941845A JP S5941845 A JPS5941845 A JP S5941845A JP 15187782 A JP15187782 A JP 15187782A JP 15187782 A JP15187782 A JP 15187782A JP S5941845 A JPS5941845 A JP S5941845A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- tape
- tape material
- lead
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 22
- 239000003973 paint Substances 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 240000002834 Paulownia tomentosa Species 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 16
- 239000011889 copper foil Substances 0.000 abstract description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052709 silver Inorganic materials 0.000 abstract description 7
- 239000004332 silver Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 230000010354 integration Effects 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 3
- 239000010410 layer Substances 0.000 description 23
- 239000012790 adhesive layer Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000012050 conventional carrier Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- ZEMPKEQAKRGZGQ-AAKVHIHISA-N 2,3-bis[[(z)-12-hydroxyoctadec-9-enoyl]oxy]propyl (z)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCCC(O)C\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CC(O)CCCCCC)COC(=O)CCCCCCC\C=C/CC(O)CCCCCC ZEMPKEQAKRGZGQ-AAKVHIHISA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000009021 linear effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15187782A JPS5941845A (ja) | 1982-08-31 | 1982-08-31 | ２層式集積回路用キヤリアテ−プ、その製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15187782A JPS5941845A (ja) | 1982-08-31 | 1982-08-31 | ２層式集積回路用キヤリアテ−プ、その製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5941845A true JPS5941845A (ja) | 1984-03-08 |
| JPH0142500B2 JPH0142500B2 (enrdf_load_stackoverflow) | 1989-09-13 |
Family
ID=15528152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15187782A Granted JPS5941845A (ja) | 1982-08-31 | 1982-08-31 | ２層式集積回路用キヤリアテ−プ、その製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5941845A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5118556A (en) * | 1989-10-03 | 1992-06-02 | Matsushita Electric Industrial Co., Ltd. | Film material for film carrier manufacture and a method for manufacturing film carrier |
-
1982
- 1982-08-31 JP JP15187782A patent/JPS5941845A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5118556A (en) * | 1989-10-03 | 1992-06-02 | Matsushita Electric Industrial Co., Ltd. | Film material for film carrier manufacture and a method for manufacturing film carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0142500B2 (enrdf_load_stackoverflow) | 1989-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1116308A (en) | Tape automated bonding test board | |
| EP1601053A1 (en) | Wired circuit board and connection structure of wired circuit board | |
| US5366794A (en) | Tape carrier for semiconductor apparatus | |
| US5953594A (en) | Method of making a circuitized substrate for chip carrier structure | |
| JPH03246993A (ja) | 実装基板 | |
| US7307854B2 (en) | Flexible wired circuit board | |
| JPH02306690A (ja) | 表面実装用配線基板の製造方法 | |
| US6110650A (en) | Method of making a circuitized substrate | |
| JPS5941845A (ja) | ２層式集積回路用キヤリアテ−プ、その製造方法 | |
| JP2529987B2 (ja) | 多層印刷配線板装置の製造方法 | |
| JP3751938B2 (ja) | Ｔａｂ用テープキャリアおよびその製造方法 | |
| JPS60100454A (ja) | プリント配線板の製法 | |
| JP2513724B2 (ja) | 半導体装置用キヤリアテ―プ | |
| JP2623980B2 (ja) | 半導体搭載用リード付き基板の製造法 | |
| US6395994B1 (en) | Etched tri-metal with integrated wire traces for wire bonding | |
| JP2787230B2 (ja) | 電子部品塔載用基板 | |
| KR0134646B1 (ko) | 역적층 초박형 패키지 및 그 제조방법 | |
| JPH0278253A (ja) | 多層プラスチックチップキャリア | |
| JPS6175596A (ja) | スルホール多層回路基板の製造方法 | |
| JP2700257B2 (ja) | 配線基板付きリードフレームとその製造方法 | |
| JPH05226839A (ja) | 多層電子部品搭載用基板の製造方法 | |
| JP4473847B2 (ja) | フレキシブル配線回路基板およびその製造方法 | |
| JPH0152916B2 (enrdf_load_stackoverflow) | ||
| Small | Tape Automated Bonding and its Impact on the PWB | |
| JPS6317589A (ja) | 二層プリント回路基板 |