JPH0142353Y2 - - Google Patents
Info
- Publication number
- JPH0142353Y2 JPH0142353Y2 JP1983157638U JP15763883U JPH0142353Y2 JP H0142353 Y2 JPH0142353 Y2 JP H0142353Y2 JP 1983157638 U JP1983157638 U JP 1983157638U JP 15763883 U JP15763883 U JP 15763883U JP H0142353 Y2 JPH0142353 Y2 JP H0142353Y2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- lead
- heater chip
- pellet
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983157638U JPS6066030U (ja) | 1983-10-11 | 1983-10-11 | ボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983157638U JPS6066030U (ja) | 1983-10-11 | 1983-10-11 | ボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6066030U JPS6066030U (ja) | 1985-05-10 |
| JPH0142353Y2 true JPH0142353Y2 (ru) | 1989-12-12 |
Family
ID=30347487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983157638U Granted JPS6066030U (ja) | 1983-10-11 | 1983-10-11 | ボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6066030U (ru) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4988607B2 (ja) * | 2008-01-08 | 2012-08-01 | ミヤチテクノス株式会社 | ヒータチップ及び接合装置及び接合方法 |
-
1983
- 1983-10-11 JP JP1983157638U patent/JPS6066030U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6066030U (ja) | 1985-05-10 |
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