JPH0139217B2 - - Google Patents
Info
- Publication number
- JPH0139217B2 JPH0139217B2 JP55034285A JP3428580A JPH0139217B2 JP H0139217 B2 JPH0139217 B2 JP H0139217B2 JP 55034285 A JP55034285 A JP 55034285A JP 3428580 A JP3428580 A JP 3428580A JP H0139217 B2 JPH0139217 B2 JP H0139217B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductors
- inspection
- mirror
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/02—Viewing or reading apparatus
- G02B27/022—Viewing apparatus
- G02B27/024—Viewing apparatus comprising a light source, e.g. for viewing photographic slides, X-ray transparancies
- G02B27/025—Viewing apparatus comprising a light source, e.g. for viewing photographic slides, X-ray transparancies and magnifying means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Microscoopes, Condenser (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3428580A JPS56130934A (en) | 1980-03-17 | 1980-03-17 | Inspecting device for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3428580A JPS56130934A (en) | 1980-03-17 | 1980-03-17 | Inspecting device for semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56130934A JPS56130934A (en) | 1981-10-14 |
| JPH0139217B2 true JPH0139217B2 (enExample) | 1989-08-18 |
Family
ID=12409880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3428580A Granted JPS56130934A (en) | 1980-03-17 | 1980-03-17 | Inspecting device for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56130934A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57115843A (en) * | 1981-01-10 | 1982-07-19 | Mitsubishi Electric Corp | Testing device for wafer |
| JPS58142548A (ja) * | 1982-02-18 | 1983-08-24 | Nec Corp | Icハンドリング装置 |
| JPH0783043B2 (ja) * | 1985-02-04 | 1995-09-06 | オリンパス光学工業株式会社 | ウエハ検査顕微鏡装置 |
| JPS6255501A (ja) * | 1985-09-04 | 1987-03-11 | Canon Inc | レ−ザ測長装置 |
| JPS6394650A (ja) * | 1986-10-08 | 1988-04-25 | Tokyo Electron Ltd | プロ−ブ装置 |
-
1980
- 1980-03-17 JP JP3428580A patent/JPS56130934A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56130934A (en) | 1981-10-14 |
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