JPH0136705B2 - - Google Patents

Info

Publication number
JPH0136705B2
JPH0136705B2 JP5730382A JP5730382A JPH0136705B2 JP H0136705 B2 JPH0136705 B2 JP H0136705B2 JP 5730382 A JP5730382 A JP 5730382A JP 5730382 A JP5730382 A JP 5730382A JP H0136705 B2 JPH0136705 B2 JP H0136705B2
Authority
JP
Japan
Prior art keywords
chip
electrode
flip
protruding electrodes
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5730382A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58175839A (ja
Inventor
Tomoko Takebe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP5730382A priority Critical patent/JPS58175839A/ja
Publication of JPS58175839A publication Critical patent/JPS58175839A/ja
Publication of JPH0136705B2 publication Critical patent/JPH0136705B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP5730382A 1982-04-08 1982-04-08 半導体装置 Granted JPS58175839A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5730382A JPS58175839A (ja) 1982-04-08 1982-04-08 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5730382A JPS58175839A (ja) 1982-04-08 1982-04-08 半導体装置

Publications (2)

Publication Number Publication Date
JPS58175839A JPS58175839A (ja) 1983-10-15
JPH0136705B2 true JPH0136705B2 (en:Method) 1989-08-02

Family

ID=13051783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5730382A Granted JPS58175839A (ja) 1982-04-08 1982-04-08 半導体装置

Country Status (1)

Country Link
JP (1) JPS58175839A (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2973691A1 (en) * 2013-03-15 2016-01-20 Microchip Technology Incorporated Insulated top side bump connection for a power device, for example for gate, source and drain contacts of a power field effect transistor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2973691A1 (en) * 2013-03-15 2016-01-20 Microchip Technology Incorporated Insulated top side bump connection for a power device, for example for gate, source and drain contacts of a power field effect transistor

Also Published As

Publication number Publication date
JPS58175839A (ja) 1983-10-15

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