JPH0135475Y2 - - Google Patents
Info
- Publication number
- JPH0135475Y2 JPH0135475Y2 JP1985130488U JP13048885U JPH0135475Y2 JP H0135475 Y2 JPH0135475 Y2 JP H0135475Y2 JP 1985130488 U JP1985130488 U JP 1985130488U JP 13048885 U JP13048885 U JP 13048885U JP H0135475 Y2 JPH0135475 Y2 JP H0135475Y2
- Authority
- JP
- Japan
- Prior art keywords
- bump
- semiconductor
- height
- blade
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 36
- 239000008188 pellet Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 241000237858 Gastropoda Species 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985130488U JPH0135475Y2 (enrdf_load_stackoverflow) | 1985-08-26 | 1985-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985130488U JPH0135475Y2 (enrdf_load_stackoverflow) | 1985-08-26 | 1985-08-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6237933U JPS6237933U (enrdf_load_stackoverflow) | 1987-03-06 |
| JPH0135475Y2 true JPH0135475Y2 (enrdf_load_stackoverflow) | 1989-10-30 |
Family
ID=31028034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985130488U Expired JPH0135475Y2 (enrdf_load_stackoverflow) | 1985-08-26 | 1985-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0135475Y2 (enrdf_load_stackoverflow) |
-
1985
- 1985-08-26 JP JP1985130488U patent/JPH0135475Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6237933U (enrdf_load_stackoverflow) | 1987-03-06 |
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