JPH0134717B2 - - Google Patents
Info
- Publication number
- JPH0134717B2 JPH0134717B2 JP56005985A JP598581A JPH0134717B2 JP H0134717 B2 JPH0134717 B2 JP H0134717B2 JP 56005985 A JP56005985 A JP 56005985A JP 598581 A JP598581 A JP 598581A JP H0134717 B2 JPH0134717 B2 JP H0134717B2
- Authority
- JP
- Japan
- Prior art keywords
- strip
- sealing material
- crimping
- band
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003566 sealing material Substances 0.000 claims description 27
- 238000002788 crimping Methods 0.000 claims description 24
- 238000005096 rolling process Methods 0.000 claims description 24
- 229910000831 Steel Inorganic materials 0.000 claims description 20
- 239000010959 steel Substances 0.000 claims description 20
- 238000000137 annealing Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 239000002344 surface layer Substances 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 description 10
- 230000003746 surface roughness Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 5
- 238000005253 cladding Methods 0.000 description 4
- 238000005097 cold rolling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 208000035874 Excoriation Diseases 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP598581A JPS57121265A (en) | 1981-01-20 | 1981-01-20 | Pressure welding method of strip for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP598581A JPS57121265A (en) | 1981-01-20 | 1981-01-20 | Pressure welding method of strip for lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57121265A JPS57121265A (en) | 1982-07-28 |
| JPH0134717B2 true JPH0134717B2 (fr) | 1989-07-20 |
Family
ID=11626094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP598581A Granted JPS57121265A (en) | 1981-01-20 | 1981-01-20 | Pressure welding method of strip for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57121265A (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59193256A (ja) * | 1983-04-18 | 1984-11-01 | Daido Steel Co Ltd | アルミニウム・クラツド金属帯片の残留歪低減方法 |
| JPS60120544A (ja) * | 1983-12-02 | 1985-06-28 | Sumitomo Electric Ind Ltd | 半導体装置用リ−ドフレ−ム |
| JPH02109357A (ja) * | 1988-10-18 | 1990-04-23 | Sumitomo Special Metals Co Ltd | プラスチックモールド用クラッド板の製造方法 |
| CN102249022B (zh) * | 2011-07-08 | 2012-11-14 | 浙江中烟工业有限责任公司 | 卷烟包装机中铝箔纸压烟徽装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5075554A (fr) * | 1973-11-08 | 1975-06-20 |
-
1981
- 1981-01-20 JP JP598581A patent/JPS57121265A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5075554A (fr) * | 1973-11-08 | 1975-06-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57121265A (en) | 1982-07-28 |
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