JPH0134717B2 - - Google Patents
Info
- Publication number
- JPH0134717B2 JPH0134717B2 JP56005985A JP598581A JPH0134717B2 JP H0134717 B2 JPH0134717 B2 JP H0134717B2 JP 56005985 A JP56005985 A JP 56005985A JP 598581 A JP598581 A JP 598581A JP H0134717 B2 JPH0134717 B2 JP H0134717B2
- Authority
- JP
- Japan
- Prior art keywords
- strip
- sealing material
- crimping
- band
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003566 sealing material Substances 0.000 claims description 27
- 238000002788 crimping Methods 0.000 claims description 24
- 238000005096 rolling process Methods 0.000 claims description 24
- 229910000831 Steel Inorganic materials 0.000 claims description 20
- 239000010959 steel Substances 0.000 claims description 20
- 238000000137 annealing Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 239000002344 surface layer Substances 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 description 10
- 230000003746 surface roughness Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 5
- 238000005253 cladding Methods 0.000 description 4
- 238000005097 cold rolling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 208000035874 Excoriation Diseases 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、Alクラツドのリードフレーム用帯
の圧着方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for crimping an Al-clad lead frame band.
（従来の技術）
最近のIC（集積回路）需要の増大に伴いICの技
術分野において多くの研究開発が進められてい
る。(Prior Art) With the recent increase in demand for ICs (integrated circuits), much research and development is underway in the technical field of ICs.
そのなかでもICリードフレームは、封着材帯
とこの封着材帯より板幅の小さいクラツド用材と
を圧延圧着した構造を有しており、両者間の圧着
強度が大きいこと、表面アラサが緻密であるこ
と、寸法精度および形状精度が高いこと、さら
に、圧着後の残留歪が小さいことなどが要求され
る。 Among these, IC lead frames have a structure in which a sealing material band and a cladding material whose width is smaller than the sealing material band are rolled and crimped, and the bonding strength between the two is high and the surface roughness is fine. , high dimensional accuracy and shape accuracy, and low residual strain after crimping.
第１図ａは従来のAl条をストライプ型に封着
材帯上にクラツドしたリードフレーム用帯の製造
方法を示す。 FIG. 1a shows a conventional method for manufacturing a lead frame strip in which Al strips are clad in stripes on a sealing material strip.
封着材帯用ペイオフリール３から引出された封
着材帯１はその表層面がワイヤブラシ５により研
磨され、さらに一方のAl条ペイオフリール４か
ら引出されたAl条２は封着材帯１と同様にワイ
ヤブラシ５′により研磨され、それぞれの研磨さ
れた面が清浄処理される。 The surface of the sealing material strip 1 pulled out from the sealing material strip payoff reel 3 is polished by a wire brush 5, and the Al strip 2 pulled out from one Al strip payoff reel 4 is attached to the sealing material strip 1. Similarly, the wire brush 5' is used for polishing, and each polished surface is cleaned.
次いで第１図ｂに示すように、ワイヤブラシ
５，５′により清浄処理された封着材帯１とAl条
２のそれぞれの研磨面を重ね合わせ、第１図ａの
圧着ロール６を通すことにより封着材帯１とAl
条２を圧延圧着し、第１図ｃに示す如き圧着帯７
を製造する。 Next, as shown in FIG. 1b, the polished surfaces of the sealing material strip 1 and the Al strip 2, which have been cleaned using wire brushes 5 and 5', are placed one on top of the other, and then passed through the pressure roll 6 shown in FIG. 1a. Sealing material strip 1 and Al
The strip 2 is rolled and crimped, and a crimping band 7 as shown in FIG.
Manufacture.
このように製造された圧着帯７は、巻取リール
８で巻取られた後、拡散焼なまし処理により圧着
強さが一層増大される。あるいは前記ワイヤブラ
シ５，５′で研磨することに代えて封着材帯１お
よびAl条２を温間域に加熱し、温間圧延するこ
とにより、封着材帯１とAl条２を圧着する。 After the crimping band 7 manufactured in this manner is wound up on a take-up reel 8, the crimping strength is further increased by diffusion annealing treatment. Alternatively, instead of polishing with the wire brushes 5 and 5', the sealing material strip 1 and the Al strip 2 are heated to a warm temperature range and warm rolled to bond the sealing material strip 1 and the Al strip 2 together. do.
（発明が解決しようとする課題）
これらの製造方法におけるAl条はワイヤブラ
シによる研磨べりや温間圧延時の加熱による強度
低下等が生じるので、これに耐え得るだけのAl
条の厚さは50μ（μm）以上が必要であつた。(Problems to be Solved by the Invention) In these manufacturing methods, Al strips suffer from abrasion due to wire brushing and a decrease in strength due to heating during warm rolling.
The thickness of the strips was required to be 50 μm or more.
封着材帯として最も一般的な42％Ni鋼を用い
た場合、圧着に必要な圧下率は40％以上であり、
この鋼帯の硬さはビツカース硬さで225〜237の範
囲にある。 When using 42% Ni steel, which is the most common material for the sealing material, the rolling reduction required for crimping is 40% or more.
The hardness of this steel strip ranges from 225 to 237 on the Bitkers scale.
一方、ICリードフレーム用として要求される
封着材帯の硬さは、その後の工程による打抜き特
性からビツカース硬さは190〜230の範囲が適正な
範囲であるが、上記方法により製造したクラツド
材ではこの適正範囲を外れ硬くなる場合が多々発
生した。 On the other hand, for the hardness of the sealing material band required for IC lead frames, a Vickers hardness of 190 to 230 is appropriate due to the punching characteristics in the subsequent process. However, there were many cases where the hardness exceeded this appropriate range.
このような場合、拡散焼なまし処理を行なうこ
とによつて硬さの低下をはかることは可能である
が、42％Ni鋼の歪取温度680℃に対し、クラツド
材Alの温度としては600℃以上にすることは好ま
しくない。 In such cases, it is possible to reduce the hardness by diffusion annealing, but the strain relief temperature for 42% Ni steel is 680°C, while the temperature for the cladding material Al is 600°C. It is not preferable to raise the temperature above ℃.
したがつて、従来は高温長時間例えば600℃で
１時間以上保持するバツチ式の焼なましを行なつ
ていたため、作業能率は著しく低下していた。 Therefore, in the past, batch annealing was carried out in which the material was held at a high temperature for a long time, for example, 600° C. for one hour or more, resulting in a significant decrease in work efficiency.
本発明は、このような従来の問題点を解決する
ためになされたものであつて、作業能率の良いリ
ードフレーム用帯の圧着方法を提供することを目
的とする。 The present invention has been made to solve these conventional problems, and it is an object of the present invention to provide a method for crimping a lead frame band with high work efficiency.
（課題を解決するための手段）
そのために、本発明のリードフレーム用帯の圧
着方法は、Al条をストライプ型に封着材帯上に
クラツドしてなるリードフレーム用帯の圧着方法
において、42％Ni鋼からなる封着材帯の表層面
を脱脂し、脱脂した表層面を直径0.08〜0.21mmの
素線からなるワイヤブラシで研磨し、研磨した封
着材帯表層面に厚さ６〜30μのAl箔条を重ね合わ
せ、重ね合わせた封着材帯とAl箔条を圧下率10
〜35％で圧延圧着した後、焼なましすることを特
徴とする。(Means for Solving the Problems) To achieve this, the method for crimping a lead frame band of the present invention includes a method for crimping a lead frame band formed by cladding an Al strip in a stripe shape on a sealing material band. %Ni steel, the degreased surface is polished with a wire brush made of strands with a diameter of 0.08 to 0.21 mm, and the polished surface of the sealant band is coated with a thickness of 6 to 6 mm. 30μ Al foil strips are stacked, and the overlapped sealing material strip and Al foil strip are rolled down at a reduction rate of 10.
It is characterized by being rolled and crimped at ~35% and then annealed.
以下、本発明を図面に基いてさらに詳細に説明
する。 Hereinafter, the present invention will be explained in more detail based on the drawings.
第２図は封着材帯42％Ni鋼におけるAl条の厚
さと圧延圧着可能な圧下率との関係を示したもの
を示す。第２図中、実線（●印）はNi鋼に0.1mm
ワイヤ素線径のブラシをかけ、Al条にブラシを
かけないもの、点線（〇印）はNi鋼およびAl条
とも0.1mmワイヤ素線径のブラシをかけたものを
示す。 Figure 2 shows the relationship between the thickness of the Al strip in the sealing material band of 42% Ni steel and the reduction ratio that allows rolling and crimp bonding. In Figure 2, the solid line (● mark) is 0.1 mm for Ni steel.
The dotted line (〇) indicates the case where the Ni steel and Al strips were brushed with a wire diameter of 0.1 mm, while the Al strip was brushed with a wire diameter of 0.1 mm.
第２図から明らかなように、特にAl条の厚さ
を30μ以下の箔にすると、圧下率を40％以下に低
下させても圧着可能となり、圧着性は著しく向上
することがわかる。 As is clear from Figure 2, especially when the Al strip is made of foil with a thickness of 30 μm or less, crimping is possible even if the rolling reduction is reduced to 40% or less, and the crimping performance is significantly improved.
42％Ni鋼の封着材帯の圧着すべき表層面だけ
にワイヤブラシをかけ、Al条の圧着すべき表層
面にはワイヤブラシをかけないで、圧下率６〜32
％の冷間圧延で圧着が可能であることを知見し
た。この場合のAl条厚さの下限は、ペイオフリ
ールからの巻戻し張力が強度的に耐え得ることか
ら6μに限定された。 Wire brush only the surface layer of the 42% Ni steel sealing material band to be crimped, do not wire brush the surface layer of the Al strip to be crimped, and apply a reduction rate of 6 to 32%.
It was found that crimping is possible with cold rolling of 10%. The lower limit of the thickness of the Al strip in this case was limited to 6μ because it could withstand the unwinding tension from the payoff reel.
封着剤帯としての42％Ni鋼の冷間圧下率と硬
さの関係は、第３図に示すように、ICリードフ
レームとしての適用範囲の硬さ（一点鎖線で示す
範囲ビツカース190〜235）を与えるため15〜35％
の圧下率が必要である。 As shown in Figure 3, the relationship between the cold reduction rate and hardness of 42% Ni steel as a sealant band is as shown in Figure 3. ) to give 15-35%
A rolling reduction ratio of
このように圧着したクラツド帯は、圧下率が15
％以上であれば硬さは保持されるので、その後圧
着強度を増すための拡散焼なましにおいて封着材
帯の硬さを低下する必要がない。このため、通常
の拡散温度250〜600℃、保持時間５〜0.5minの
拡散焼なまし条件で充分であり、したがつて、連
続光輝焼なまし等を用いることにより、相対的に
低温かつ短時間の焼なましによりバツチ式の焼な
ましに比べて生産能率を著しく向上できる。 The clad band crimped in this way has a reduction ratio of 15
% or more, the hardness is maintained, so there is no need to reduce the hardness of the sealing material band in subsequent diffusion annealing to increase the bonding strength. For this reason, the usual diffusion annealing conditions of 250 to 600°C and a holding time of 5 to 0.5 min are sufficient. Therefore, by using continuous bright annealing, etc., it is possible to Time annealing can significantly improve production efficiency compared to batch annealing.
なお、最小圧下率15％は、圧着圧延時のみに付
与するだけでなく、例えば圧着圧延で10％の圧下
率を与え、その後、拡散焼なましを施した後の仕
上圧延で不足分の圧下率を与えることにより封着
材の必要硬さを得ることもできる。 Note that the minimum rolling reduction of 15% is applied not only during pressure rolling, but also for example, applying a reduction of 10% during pressure rolling, and then applying the short reduction during finish rolling after diffusion annealing. The required hardness of the sealing material can also be obtained by giving a certain ratio.
ICリードフレーム帯は、そのメツキ性から表
面アラサが規制され、一般的には、1μ（平均値）
以下のレベルが要求されている。 The surface roughness of IC lead frame strips is regulated due to its plating properties, and is generally 1μ (average value).
The following levels are required.
第４図は、ワイヤブラシのワイヤ素線径が圧延
後の表面アラサにおよぼす影響を示したもので、
図中Ａは圧下率15％圧延のもの、Ｂは同35％圧延
のものであり、Ｃは表面アラサ1μ以下の限界線
を表わす。第４図から明らかなように、圧延後の
表面アラサは同一圧下率においてワイヤブラシの
素線径が細くなるほど滑らかな表面状態となる。 Figure 4 shows the influence of the wire wire diameter of the wire brush on the surface roughness after rolling.
In the figure, A shows the product rolled with a reduction ratio of 15%, B shows the product rolled with the same reduction ratio of 35%, and C shows the limit line for surface roughness of 1 μm or less. As is clear from FIG. 4, the surface roughness after rolling becomes smoother as the wire diameter of the wire brush becomes smaller at the same rolling reduction ratio.
発明者はワイヤ素線径を変化させながら順次封
着材の研掃効果および圧着性を実験した。その結
果を第５図に示す。 The inventor sequentially experimented with the cleaning effect and crimping properties of the sealing material while changing the wire diameter. The results are shown in FIG.
第５図は、42％Ni鋼帯の表層面を研磨するワ
イヤブラシのワイヤ素線径を変えることにより
Al条の厚さと圧着可能圧下率との関係がどのよ
うに変化するかを比較したものである。Al条に
はいずれもブラシをかけなかつた。 Figure 5 shows that by changing the wire diameter of the wire brush used to polish the surface of a 42% Ni steel strip.
This is a comparison of how the relationship between the thickness of the Al strip and the crimping reduction ratio changes. None of the Al strips were brushed.
第５図中、Ａに示すように、42％Ni鋼帯およ
びAl条の双方ともブラシをかけなかつたときは、
ほとんど圧延圧着することができなかつた。 As shown in A in Figure 5, when neither the 42% Ni steel strip nor the Al strip is brushed,
It was almost impossible to roll and crimp.
Ｂに示すように、42％Ni鋼帯にワイヤ素線径
0.05mmのブラシをかけたときは、Al条の厚さをか
なり薄くしても35％以下の圧下率では圧着不能で
あつた。 As shown in B, wire strand diameter is applied to 42% Ni steel strip.
When applying a brush of 0.05 mm, even if the thickness of the Al strip was made considerably thinner, crimping was impossible at a reduction rate of 35% or less.
Ｃに示すように、42％Ni鋼帯にワイヤ線素径
0.08mmのブラシをかけたときは、Al条の厚さを薄
くすれば、35％の圧下率で圧着可能であつた。 As shown in C, the wire diameter is set on the 42% Ni steel strip.
When applying a brush of 0.08 mm, crimping was possible with a reduction rate of 35% by reducing the thickness of the Al strip.
Ｄに示すように、42％Ni鋼帯にワイヤ素線径
0.1mmのブラシをかけたとき、Al条の厚さが６〜
30μの範囲で圧下率35％以下の低い圧下率で圧延
圧着が可能であつた。 As shown in D, wire strand diameter is applied to 42% Ni steel strip.
When brushed with 0.1mm, the thickness of Al strip is 6~
Rolling and crimping was possible in the range of 30μ with a low rolling reduction of 35% or less.
Ｅに示すように、42％Ni鋼帯にワイヤ素線径
0.22mmのブラシをかけたときは、かなり低い圧下
率で圧延圧着が可能であつた。しかし、この場合
には圧着面以外の表層面の表面アラサが粗くな
り、メツキ性等の観点からICリードフレーム帯
として不適当なものになる。 As shown in E, wire strand diameter is set on 42% Ni steel strip.
When brushed with a thickness of 0.22 mm, rolling crimping was possible with a fairly low rolling reduction. However, in this case, the surface roughness of the surface layer other than the crimping surface becomes rough, making it unsuitable for use as an IC lead frame band from the viewpoint of plating properties and the like.
以上結果から、ワイヤブラシのワイヤ素線径の
適正範囲は0.08〜0.21mmが好ましいことが確認で
きた。 From the above results, it was confirmed that the appropriate range of wire diameter of the wire brush is preferably 0.08 to 0.21 mm.
（実施例） 本発明の実施例について説明する。(Example) Examples of the present invention will be described.
板厚0.35mm、板幅100mmのNi42％Ni鋼帯に焼な
ましを施し、ビツカース硬さ145に調整し、この
Ni鋼帯の表面層を脱脂した後、圧着すべき表層
面をワイヤ素線径0.1mmのワイヤブラシで研掃し
た。 A 42% Ni steel strip with a thickness of 0.35 mm and a width of 100 mm was annealed and adjusted to a Bitkers hardness of 145.
After degreasing the surface layer of the Ni steel strip, the surface layer to be crimped was polished with a wire brush having a wire diameter of 0.1 mm.
この42％Ni鋼帯のワイヤブラシ研掃面に厚さ
15μ、幅５mmの焼なましを施したAl条４本を幅ガ
イド装置を通して重ね合わせ、これらと連続した
冷間圧延機によつて１パスで0.3mmに圧延圧着し
た。 The thickness of this 42% Ni steel strip is wire brushed on the surface
Four annealed Al strips of 15 μm and width of 5 mm were stacked together through a width guide device, and rolled and crimped to 0.3 mm in one pass by a cold rolling machine connected to these strips.
このようにして製造した圧着材はAl面を外側
または内側に180゜曲げ試験を行なつたが、Ni鋼帯
とAl条間に剥離の減少は全く生ずることなく密
着状態であることが認められた。 The crimped material manufactured in this way was subjected to a 180° bending test with the Al surface outward or inward, and it was found that the Ni steel strip and the Al strip were in close contact with each other without any decrease in peeling. Ta.
次いで、この圧着材を温度550℃×0.5分の条件
でアンモニア分解ガス雰囲気中で焼なましした
後、冷間圧延機で厚さ0.254mmに圧延した。 Next, this crimped material was annealed in an ammonia decomposition gas atmosphere at a temperature of 550° C. for 0.5 minutes, and then rolled to a thickness of 0.254 mm using a cold rolling mill.
さらに、この圧着材を矯正し、各々のAl条を
幅23mmにスリツトしてリードフレーム用クラツド
帯を得た。このクラツド帯の硬さはビツカース硬
さ215、表面アラサ0.5〜0.65μであり、さらにこ
のクラツド帯を530℃×10分等条件下で大気加熱
したところ、圧着部にフクレ等の異状はなく、リ
ードフレーム用帯としての必要条件を充分に満足
するものであつた。 Furthermore, this crimp material was straightened and each Al strip was slit to a width of 23 mm to obtain a clad band for a lead frame. The hardness of this clad band is 215 in Bitker's hardness, and the surface roughness is 0.5 to 0.65μ.Furthermore, when this clad band was heated in the atmosphere at 530°C for 10 minutes, there was no abnormality such as blistering at the crimped part. This sufficiently satisfied the requirements for a lead frame belt.
（発明の効果）
以上説明したように、本発明のリードフレーム
用帯の圧着方法によれば、Al条の板厚を薄くし、
Al条と封着材帯を所定の圧下率により圧延圧着
したので、圧延圧着後の焼なまし条件が相対的に
低温かつ短時間で処理できるため、生産能率の良
い焼きなましにより生産作業能率を向上させつつ
圧延圧着することができるとともに、圧着材の表
面アラサを滑らかにし、メツキ性の良いICリー
ドフレームが得られるという効果がある。(Effects of the Invention) As explained above, according to the lead frame band crimping method of the present invention, the thickness of the Al strip can be reduced,
Since the Al strip and the sealing material strip are rolled and crimped at a predetermined rolling reduction ratio, the annealing conditions after rolling and crimping can be performed at a relatively low temperature and in a short time, improving production efficiency through annealing with high production efficiency. This has the effect of not only being able to roll and press the bonding material while smoothing it, but also smoothing out the surface roughness of the bonding material, resulting in an IC lead frame with good plating properties.
第１図ａは圧着帯の製造工程を示す一実施例の
説明図、同ｂは封着材上にクラツド用材を重ね合
わせた状態図、同ｃは圧延後の圧着帯断面図、第
２図はAl条の厚さと圧着可能圧下率の関係が変
化する様子を表わす図、第３図は封着材の圧下率
と硬さの関係を示した図、第４図はワイヤブラシ
の素線径と圧延後の表面アラサの関係を示した
図、第５図はワイヤブラシ素線径が変わることに
よりAl条の厚さと圧着可能圧下率の関係が変化
する様子を表わす図である。
１…封着材、２…Al条、３，４…ペイオフリ
ール、５，５′…ワイヤブラシ、６…圧着ロール、
７…圧着帯、８…巻取リール。
Fig. 1a is an explanatory diagram of one embodiment showing the manufacturing process of the crimp band, Fig. 1b is a diagram of the state in which the cladding material is superimposed on the sealing material, Fig. 1c is a sectional view of the crimp band after rolling, and Fig. 2 Figure 3 shows the relationship between the thickness of the Al strip and the rolling reduction that can be crimped, Figure 3 shows the relationship between the rolling reduction of the sealing material and its hardness, and Figure 4 shows the wire diameter of the wire brush. FIG. 5 is a diagram showing the relationship between the thickness of the Al strip and the rolling reduction ratio that can be crimped as the diameter of the wire brush wire changes. 1... Sealing material, 2... Al strip, 3, 4... Payoff reel, 5, 5'... Wire brush, 6... Pressure roll,
7...Crimp band, 8...Take-up reel.
Claims (1)
ドしてなるリードフレーム用帯の圧着方法におい
て、42％Ni鋼からなる封着材帯の表層面を脱脂
し、脱脂した表層面を直径0.08〜0.21mmの素線か
らなるワイヤブラシで研磨し、研磨した封着材帯
表層面に厚さ６〜30μのAl箔条を重ね合わせ、重
ね合わせた封着材帯とAl箔条を圧下率10〜35％
で圧延圧着した後、焼なましすることを特徴とす
るリードフレーム用帯の圧着方法。1. In a method for crimping a lead frame strip made of striped Al strips clad on a sealing material strip, the surface layer of the sealing material strip made of 42% Ni steel is degreased, and the degreased surface layer is made with a diameter of 0.08 mm. Polished with a wire brush made of ~0.21mm wire, overlaid an Al foil strip with a thickness of 6 to 30μ on the polished surface of the sealing material strip, and reducing the rolling reduction ratio of the overlapped sealing material strip and Al foil strip. 10-35%
A method for crimping a band for a lead frame, which comprises rolling and crimping the lead frame and then annealing it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP598581A JPS57121265A (en) | 1981-01-20 | 1981-01-20 | Pressure welding method of strip for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP598581A JPS57121265A (en) | 1981-01-20 | 1981-01-20 | Pressure welding method of strip for lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57121265A JPS57121265A (en) | 1982-07-28 |
| JPH0134717B2 true JPH0134717B2 (en) | 1989-07-20 |
Family
ID=11626094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP598581A Granted JPS57121265A (en) | 1981-01-20 | 1981-01-20 | Pressure welding method of strip for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57121265A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59193256A (en) * | 1983-04-18 | 1984-11-01 | Daido Steel Co Ltd | Reduction of residual strain of aluminum clad metal strip piece |
| JPS60120544A (en) * | 1983-12-02 | 1985-06-28 | Sumitomo Electric Ind Ltd | Lead frame for semiconductor device |
| JPH02109357A (en) * | 1988-10-18 | 1990-04-23 | Sumitomo Special Metals Co Ltd | Manufacture of clad plate for plastic molding |
| CN102249022B (en) * | 2011-07-08 | 2012-11-14 | 浙江中烟工业有限责任公司 | Aluminum foil indentation pattern rolling device used in cigarette packing machine |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5075554A (en) * | 1973-11-08 | 1975-06-20 |
-
1981
- 1981-01-20 JP JP598581A patent/JPS57121265A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5075554A (en) * | 1973-11-08 | 1975-06-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57121265A (en) | 1982-07-28 |
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