JPH0133959B2 - - Google Patents
Info
- Publication number
- JPH0133959B2 JPH0133959B2 JP4335683A JP4335683A JPH0133959B2 JP H0133959 B2 JPH0133959 B2 JP H0133959B2 JP 4335683 A JP4335683 A JP 4335683A JP 4335683 A JP4335683 A JP 4335683A JP H0133959 B2 JPH0133959 B2 JP H0133959B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- metal plate
- insulator
- metal
- clad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 239000002184 metal Substances 0.000 claims description 38
- 239000012212 insulator Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 239000011889 copper foil Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 20
- 238000009413 insulation Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4335683A JPS59168696A (ja) | 1983-03-15 | 1983-03-15 | 金属ベ−ス印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4335683A JPS59168696A (ja) | 1983-03-15 | 1983-03-15 | 金属ベ−ス印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59168696A JPS59168696A (ja) | 1984-09-22 |
| JPH0133959B2 true JPH0133959B2 (zh) | 1989-07-17 |
Family
ID=12661569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4335683A Granted JPS59168696A (ja) | 1983-03-15 | 1983-03-15 | 金属ベ−ス印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59168696A (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62214696A (ja) * | 1986-03-15 | 1987-09-21 | 松下電工株式会社 | プリント配線板およびその製造方法 |
| JPH10117069A (ja) * | 1996-10-08 | 1998-05-06 | Denki Kagaku Kogyo Kk | 金属ベース多層回路基板 |
-
1983
- 1983-03-15 JP JP4335683A patent/JPS59168696A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59168696A (ja) | 1984-09-22 |
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