JPH01321644A - 印刷回路基板 - Google Patents
印刷回路基板Info
- Publication number
- JPH01321644A JPH01321644A JP63155739A JP15573988A JPH01321644A JP H01321644 A JPH01321644 A JP H01321644A JP 63155739 A JP63155739 A JP 63155739A JP 15573988 A JP15573988 A JP 15573988A JP H01321644 A JPH01321644 A JP H01321644A
- Authority
- JP
- Japan
- Prior art keywords
- gold paste
- bonding pad
- paste
- wire bonding
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/075—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H10W72/536—
-
- H10W72/952—
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63155739A JPH01321644A (ja) | 1988-06-23 | 1988-06-23 | 印刷回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63155739A JPH01321644A (ja) | 1988-06-23 | 1988-06-23 | 印刷回路基板 |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5331896A Division JPH06293151A (ja) | 1993-12-27 | 1993-12-27 | 熱印字用印刷回路基板 |
| JP5331897A Division JPH06293149A (ja) | 1993-12-27 | 1993-12-27 | 熱印字用印刷回路基板 |
| JP5331895A Division JP2667787B2 (ja) | 1993-12-27 | 1993-12-27 | サーマルプリントヘッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01321644A true JPH01321644A (ja) | 1989-12-27 |
| JPH0426782B2 JPH0426782B2 (OSRAM) | 1992-05-08 |
Family
ID=15612382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63155739A Granted JPH01321644A (ja) | 1988-06-23 | 1988-06-23 | 印刷回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01321644A (OSRAM) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5876286A (ja) * | 1981-10-31 | 1983-05-09 | Mitsubishi Electric Corp | サ−マルヘツド |
-
1988
- 1988-06-23 JP JP63155739A patent/JPH01321644A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5876286A (ja) * | 1981-10-31 | 1983-05-09 | Mitsubishi Electric Corp | サ−マルヘツド |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0426782B2 (OSRAM) | 1992-05-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090508 Year of fee payment: 17 |