JPH01309338A - 樹脂封止形半導体装置の製造方法 - Google Patents

樹脂封止形半導体装置の製造方法

Info

Publication number
JPH01309338A
JPH01309338A JP1086909A JP8690989A JPH01309338A JP H01309338 A JPH01309338 A JP H01309338A JP 1086909 A JP1086909 A JP 1086909A JP 8690989 A JP8690989 A JP 8690989A JP H01309338 A JPH01309338 A JP H01309338A
Authority
JP
Japan
Prior art keywords
strip
support plate
resin
mold
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1086909A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451974B2 (cg-RX-API-DMAC7.html
Inventor
Takaaki Yokoyama
隆昭 横山
Yoshiharu Tada
多田　吉晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1086909A priority Critical patent/JPH01309338A/ja
Publication of JPH01309338A publication Critical patent/JPH01309338A/ja
Publication of JPH0451974B2 publication Critical patent/JPH0451974B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1086909A 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法 Granted JPH01309338A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1086909A JPH01309338A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1086909A JPH01309338A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP59159047A Division JPS6156420A (ja) 1984-07-31 1984-07-31 樹脂封止形半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP3042377A Division JPH04211138A (ja) 1991-02-15 1991-02-15 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH01309338A true JPH01309338A (ja) 1989-12-13
JPH0451974B2 JPH0451974B2 (cg-RX-API-DMAC7.html) 1992-08-20

Family

ID=13899969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1086909A Granted JPH01309338A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH01309338A (cg-RX-API-DMAC7.html)

Also Published As

Publication number Publication date
JPH0451974B2 (cg-RX-API-DMAC7.html) 1992-08-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees