JPH0129063B2 - - Google Patents
Info
- Publication number
- JPH0129063B2 JPH0129063B2 JP59011044A JP1104484A JPH0129063B2 JP H0129063 B2 JPH0129063 B2 JP H0129063B2 JP 59011044 A JP59011044 A JP 59011044A JP 1104484 A JP1104484 A JP 1104484A JP H0129063 B2 JPH0129063 B2 JP H0129063B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holder
- suction
- urethane foam
- suction piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P72/78—
-
- H10P72/50—
Landscapes
- Manipulator (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59011044A JPS60157231A (ja) | 1984-01-26 | 1984-01-26 | ウエ−ハロ−ダ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59011044A JPS60157231A (ja) | 1984-01-26 | 1984-01-26 | ウエ−ハロ−ダ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60157231A JPS60157231A (ja) | 1985-08-17 |
| JPH0129063B2 true JPH0129063B2 (OSRAM) | 1989-06-07 |
Family
ID=11767041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59011044A Granted JPS60157231A (ja) | 1984-01-26 | 1984-01-26 | ウエ−ハロ−ダ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60157231A (OSRAM) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07264B2 (ja) * | 1987-08-10 | 1995-01-11 | 住友電気工業株式会社 | 半導体ウエハの貼付方法および装置 |
| US5443416A (en) * | 1993-09-09 | 1995-08-22 | Cybeq Systems Incorporated | Rotary union for coupling fluids in a wafer polishing apparatus |
| KR100967222B1 (ko) | 2008-06-16 | 2010-07-05 | 정진황 | 이송챔버 및 기판이송방법 |
| JP5493633B2 (ja) | 2009-09-18 | 2014-05-14 | 株式会社Sumco | 研磨方法及びその装置 |
| US9355882B2 (en) * | 2013-12-04 | 2016-05-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Transfer module for bowed wafers |
| CN106826510A (zh) * | 2016-12-30 | 2017-06-13 | 郑州晶润光电技术有限公司 | 一种晶片扫光工艺 |
-
1984
- 1984-01-26 JP JP59011044A patent/JPS60157231A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60157231A (ja) | 1985-08-17 |
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