JPH0126533B2 - - Google Patents

Info

Publication number
JPH0126533B2
JPH0126533B2 JP57080389A JP8038982A JPH0126533B2 JP H0126533 B2 JPH0126533 B2 JP H0126533B2 JP 57080389 A JP57080389 A JP 57080389A JP 8038982 A JP8038982 A JP 8038982A JP H0126533 B2 JPH0126533 B2 JP H0126533B2
Authority
JP
Japan
Prior art keywords
insulating film
polycrystalline silicon
bonding pad
metal layer
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57080389A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58197736A (ja
Inventor
Hiroaki Okizaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP57080389A priority Critical patent/JPS58197736A/ja
Publication of JPS58197736A publication Critical patent/JPS58197736A/ja
Publication of JPH0126533B2 publication Critical patent/JPH0126533B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/59—
    • H10W72/923—
    • H10W72/952—
    • H10W72/983—

Landscapes

  • Wire Bonding (AREA)
JP57080389A 1982-05-13 1982-05-13 半導体装置 Granted JPS58197736A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57080389A JPS58197736A (ja) 1982-05-13 1982-05-13 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57080389A JPS58197736A (ja) 1982-05-13 1982-05-13 半導体装置

Publications (2)

Publication Number Publication Date
JPS58197736A JPS58197736A (ja) 1983-11-17
JPH0126533B2 true JPH0126533B2 (enExample) 1989-05-24

Family

ID=13716928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57080389A Granted JPS58197736A (ja) 1982-05-13 1982-05-13 半導体装置

Country Status (1)

Country Link
JP (1) JPS58197736A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2641998B2 (ja) * 1991-03-20 1997-08-20 ローム 株式会社 半導体装置
CN1107979C (zh) 1995-07-14 2003-05-07 松下电器产业株式会社 半导体器件的电极结构、形成方法及安装体和半导体器件

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5239378A (en) * 1975-09-23 1977-03-26 Seiko Epson Corp Silicon-gated mos type semiconductor device
JPS55140245A (en) * 1979-04-18 1980-11-01 Fujitsu Ltd Manufacture of semiconductor element

Also Published As

Publication number Publication date
JPS58197736A (ja) 1983-11-17

Similar Documents

Publication Publication Date Title
US5504036A (en) Method of manufacturing semiconductor devices with semiconductor elements formed in a layer of semiconductor material provided on a support slice
US4151545A (en) Semiconductor electric circuit device with plural-layer aluminum base metallization
JPH05343406A (ja) 半導体装置
JPH09260645A (ja) 半導体装置
JPS594853B2 (ja) 半導体装置
JPH0126533B2 (enExample)
JPH0622235B2 (ja) 半導体装置の製造方法
JPH065694B2 (ja) 半導体装置
JPH0122989B2 (enExample)
JPS59229866A (ja) 半導体装置
JP3035945B2 (ja) 半導体装置
JPS63260149A (ja) 半導体装置
JPH0394401A (ja) 感温センサ
JPH0440271Y2 (enExample)
JPH05175197A (ja) 半導体装置の配線
JPH0233949A (ja) 半導体ヒューズ素子
JPS5858757A (ja) 半導体装置
JPS5982774A (ja) 半導体装置
JPS61114558A (ja) 半導体集積回路装置
JPH05144808A (ja) 半導体装置及びその製造方法
JPS623981B2 (enExample)
JPH03116852A (ja) 半導体装置
JPH01133363A (ja) 半導体装置
JPS6228581B2 (enExample)
JPH0230139A (ja) 半導体集積回路装置