JPH01261884A - Conductor pattern for through hole printing - Google Patents
Conductor pattern for through hole printingInfo
- Publication number
- JPH01261884A JPH01261884A JP8892388A JP8892388A JPH01261884A JP H01261884 A JPH01261884 A JP H01261884A JP 8892388 A JP8892388 A JP 8892388A JP 8892388 A JP8892388 A JP 8892388A JP H01261884 A JPH01261884 A JP H01261884A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- dividing
- printing
- mask
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 30
- 239000000919 ceramic Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 21
- 230000005611 electricity Effects 0.000 claims 1
- 239000012466 permeate Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、厚膜印刷回路基板等で用いられるスルーホー
ル印刷での印刷用導体パターンに関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed conductor pattern for through-hole printing used in thick film printed circuit boards and the like.
（従来の技術）
従来、第５図に示すようなセラミック基板１１上の、セ
ラミック基板１１を個片に分割するための分割溝１２と
交わった貫通孔１３に導体ペーストを塗布するためのス
ルーホール印刷用導体パターンは、第６図に示すような
構成であった。同図において。(Prior Art) Conventionally, a through hole for applying conductive paste to a through hole 13 intersecting with a dividing groove 12 for dividing the ceramic substrate 11 into individual pieces on a ceramic substrate 11 as shown in FIG. The printed conductor pattern had a configuration as shown in FIG. In the same figure.
１１はセラミック基板、１２はセラミック基板１１を個
片に分割するために設けられた分割溝、１３はセラミッ
ク基板１１の貫通孔であり、１４はセラミック基板ｌｌ
上の分割溝１２．貫通孔１３の位置関係に対して描かれ
たマスクの開口部を示す導体パターンである。11 is a ceramic substrate, 12 is a dividing groove provided for dividing the ceramic substrate 11 into individual pieces, 13 is a through hole of the ceramic substrate 11, and 14 is a ceramic substrate ll.
Upper dividing groove 12. This is a conductor pattern showing the opening of the mask drawn with respect to the positional relationship of the through hole 13.
以上のように構成されたスルーホール印刷用導体パター
ンについて説明する。セラミック基板１１上に、スルー
ホール印刷用導体パターン１４が描かれた印刷マスクを
、セラミック基板１１の分割溝１２と貫通孔１３を位置
基準にして位置合わせし、スルーホール印刷法により導
体ペーストを印刷する。The through-hole printing conductor pattern configured as described above will be explained. A printing mask on which a conductive pattern 14 for through-hole printing is drawn is aligned on the ceramic substrate 11 using the dividing grooves 12 and through-holes 13 of the ceramic substrate 11 as positional standards, and a conductive paste is printed by the through-hole printing method. do.
印刷後のセラミック基板の状態を第７図に示す。FIG. 7 shows the state of the ceramic substrate after printing.
同図において、導体ペースト１５をスルーホール印刷し
た際にセラミック基板１１上に印刷したペーストは１５
ａとして印刷され、貫通孔１３上に印刷したペーストは
、スルーホール印刷され、貫通孔１３の内面に１５ｂの
ように塗布される。In the figure, the paste printed on the ceramic substrate 11 when through-hole printing the conductive paste 15 is 15
The paste printed as a and printed on the through hole 13 is through-hole printed and applied to the inner surface of the through hole 13 as shown in 15b.
（発明が解決しようとする課題）
上記、従来の構成では、貫通孔１３の周辺部分の分割溝
上に導体ペーストを印刷しなければならず。(Problems to be Solved by the Invention) In the conventional configuration described above, a conductive paste must be printed on the dividing grooves in the peripheral portion of the through hole 13.
第７図の１５ｃに示すように、毛細管現象で分割溝内に
導体ペーストかにじむことにより、個片に分割する際、
分割性を悪くしたり、また隣り合う貫通孔の導体間が短
かくなり絶縁性をさまたげたり、極端なものでは１貫通
孔の導体間で短絡するという現象があられれる等の欠点
があった。As shown at 15c in FIG. 7, when dividing into individual pieces, the conductive paste bleeds into the dividing groove due to capillary action.
There have been drawbacks such as poor divisibility, shortening of the distance between conductors in adjacent through holes, which impedes insulation, and in extreme cases short circuits between conductors in one through hole.
本発明の目的は、従来の欠点を解消し、セラミック基板
上の分割溝と交わった貫通孔に導体ペーストをスルーホ
ール印刷する場合でも１分割溝内に導体ペーストを印刷
せず、かつ貫通孔内面に導体ペーストを塗布することで
ある。An object of the present invention is to eliminate the conventional drawbacks, and even when printing conductive paste through holes that intersect with dividing grooves on a ceramic substrate, the conductive paste is not printed within one dividing groove, and the inner surface of the through hole is The method is to apply conductive paste to the
（課題を解決するための手段）
本発明のスルーホール印刷用導体パターンは、個片に分
割することを可能にする分割溝をもつセラミック基板の
両面を導通させるための分割溝と交わる貫通孔に、導体
ペーストをスルーホール印刷により塗布するとき１分割
溝と、この分割溝と貫通孔の円周の交点をマスクの開口
部としないものである。(Means for Solving the Problems) The conductor pattern for through-hole printing of the present invention has a through-hole that intersects with the dividing groove for making conduction between both sides of a ceramic substrate, which has dividing grooves that enable it to be divided into individual pieces. When the conductor paste is applied by through-hole printing, the intersection of one dividing groove and the circumference of this dividing groove and the through hole is not made into the opening of the mask.
（作 用）
上記構成により、セラミック基板上の分割溝と交わった
貫通孔に導体ペーストをスルーホール印刷する場合でも
、分割溝と、分割溝と貫通孔の円周との交点をマスクの
開口部としないので１分割溝内に導体ペーストを印刷せ
ず、がっ分割溝内に導体ペーストが入り込まず１貫通孔
内面に導体ペーストを塗布することができる。(Function) With the above configuration, even when through-hole printing conductor paste into the through-holes that intersect with the dividing grooves on the ceramic substrate, the intersection of the dividing grooves and the circumference of the dividing grooves and the through-holes can be used as the opening of the mask. Therefore, the conductive paste is not printed in the one dividing groove, and the conductive paste can be applied to the inner surface of the one through hole without entering the dividing groove.
（実施例）
本発明の一実施例を第１図ないし第４図に基づいて説明
する。第１図は本発明のスルーホール印刷用導体パター
ンの構成図である。同図において、１はセラミック基板
、２はセラミック基板１を個片に分割するために設けら
れた分割溝、３はセラミック基板１の貫通孔、４はセラ
ミック基板１上の分割溝２９貫通孔３の位置関係に対し
て描かれたマスクの開口部を示す導体パターンであり、
２ａは分割溝２と貫通孔３の円周の交点部である。(Example) An example of the present invention will be described based on FIGS. 1 to 4. FIG. 1 is a configuration diagram of a conductor pattern for through-hole printing according to the present invention. In the figure, 1 is a ceramic substrate, 2 is a dividing groove provided to divide the ceramic substrate 1 into individual pieces, 3 is a through hole in the ceramic substrate 1, and 4 is a dividing groove 29 on the ceramic substrate 1; A conductor pattern showing the opening of the mask drawn with respect to the positional relationship of
2a is the intersection of the circumferences of the dividing groove 2 and the through hole 3.
以上のように本実施例によれば、導体パターン４は、分
割溝２と、分割溝２と貫通孔３の円周との交点部２ａを
マスクの開口部としないので、第２図に示すように１分
割溝２内に導体ペースト５が入り込まず、分割溝２内に
導体ペースト５が入り込みにじむことにより、分割性を
悪くしたり、隣り合う貫通孔の導体間で絶縁性を妨げた
り、短絡を発生させたりすることは皆無にでき、かつ。As described above, according to this embodiment, the conductor pattern 4 does not use the dividing groove 2 and the intersection 2a of the dividing groove 2 and the circumference of the through hole 3 as the opening of the mask, as shown in FIG. As shown in the figure, the conductive paste 5 does not enter into the dividing groove 2, and the conductive paste 5 enters the dividing groove 2 and bleeds, resulting in poor dividing performance and impeding insulation between conductors in adjacent through holes. It is possible to completely eliminate the occurrence of short circuits, and.
貫通孔３の内面３ａに導体ペースト５を塗布することが
できる。A conductive paste 5 can be applied to the inner surface 3a of the through hole 3.
なお１本実施例においては、貫通孔に交わる分割溝が一
本だけの場合としたが、第３図に示すように、貫通孔３
に異なる２本の分割溝２が交わる場合でも同様で１分割
溝２と、分割溝２と貫通孔３の円周との交点部２ａをマ
スクの開口部としないような導体パターン４を描くこと
により、第４図に示すように１分割溝２内に導体ペース
ト５を入り込ませず１貫通孔３の内面３ａに導体ペース
ト５を塗布するスルーホール印刷ができる。In this embodiment, only one dividing groove intersects with the through hole, but as shown in FIG.
Similarly, even when two different dividing grooves 2 intersect, the conductor pattern 4 should be drawn in such a way that the intersection 2a of the dividing groove 2, the dividing groove 2, and the circumference of the through hole 3 does not become the opening of the mask. As a result, as shown in FIG. 4, through-hole printing can be performed in which conductive paste 5 is applied to the inner surface 3a of one through hole 3 without entering the conductive paste 5 into one dividing groove 2.
（発明の効果）
本発明によれば、セラミック基板上の分割溝と交わった
貫通孔に導体ペーストをスルーホール印刷する場合でも
、分割溝と１分割溝と貫通孔の円周との交点をマスクの
開口部としないような導体パターンを設けることにより
、分割溝内に導体ペーストが入り込まず、分割溝内に導
体ペーストが入り込みにじむことにより分割性を悪くし
たり、隣り合う貫通孔間で絶縁性を妨げたり、短絡不良
を発生させたりすることを皆無にすることができ、その
実用上の効果は大である。(Effects of the Invention) According to the present invention, even when through-hole printing a conductive paste in a through hole that intersects with a dividing groove on a ceramic substrate, the intersection of the dividing groove, one dividing groove, and the circumference of the through hole is masked. By providing a conductor pattern that does not form an opening in the hole, the conductor paste will not get into the dividing groove, and the conductive paste will get into the dividing groove and bleed, resulting in poor dividing performance and the insulation between adjacent through holes. It is possible to completely eliminate problems such as interfering with the circuit or causing short-circuit failures, and its practical effects are great.
第１図、第３図は本発明の一実施例におけるスルーホー
ル印刷用導体パターンの構成図、第２図。
第４図は本発明の効果を示す説明図、第５図は従来のス
ルーホール印刷用導体パターンの構成図。
第６図は従来の方法での問題点を示す説明図、第７図は
分割溝上で交わる貫通孔をもつセラミック基板の一部切
欠斜視図である。
１ ・・・セラミック基板、２・・・分割溝、３・・・
貫通孔、４ ・・・導体パターン。
５・・・導体ペースト。
特許出願人 松下電器産業株式会社
第１図
（０）（。）
１ ・・亡りミック６板 ２ 入側溝 ３
貫通１４ 塘Ａ参パターン ５ 導べ訃４−
スト第３図
第４図
第５図
第６図
（ｌ
第７図
（ｏｌ ｉｃ）
日1 and 3 are configuration diagrams of a conductor pattern for through-hole printing in an embodiment of the present invention, and FIG. FIG. 4 is an explanatory diagram showing the effects of the present invention, and FIG. 5 is a configuration diagram of a conventional conductor pattern for through-hole printing. FIG. 6 is an explanatory diagram showing problems with the conventional method, and FIG. 7 is a partially cutaway perspective view of a ceramic substrate having through holes that intersect on the dividing grooves. 1...Ceramic substrate, 2...Dividing groove, 3...
Through hole, 4...conductor pattern. 5... Conductor paste. Patent applicant: Matsushita Electric Industrial Co., Ltd. Figure 1 (0) (.) 1 . . . Dead Mick 6 board 2 Inlet groove 3
Penetration 14 Tong A pattern 5 Guide death 4-
Figure 3 Figure 4 Figure 5 Figure 6 (l Figure 7 (ol ic)
Claims (1)
ク基板の両面を導通させるため、前記分割溝と交わる貫
通孔に、導体ペーストをスルーホール印刷により塗布す
るとき、前記分割溝と、前記分割溝と、前記貫通孔の円
周との交点をマスクの開口部としないことを特徴とする
スルーホール印刷用導体パターン。When applying conductive paste by through-hole printing to the through-holes that intersect with the dividing grooves in order to conduct electricity between both sides of a ceramic substrate that has dividing grooves that allow it to be divided into individual pieces, the dividing grooves and the dividing A conductor pattern for through-hole printing, characterized in that the intersection of the groove and the circumference of the through-hole is not an opening of a mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63088923A JPH0767001B2 (en) | 1988-04-13 | 1988-04-13 | Substrate for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63088923A JPH0767001B2 (en) | 1988-04-13 | 1988-04-13 | Substrate for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01261884A true JPH01261884A (en) | 1989-10-18 |
| JPH0767001B2 JPH0767001B2 (en) | 1995-07-19 |
Family
ID=13956435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63088923A Expired - Lifetime JPH0767001B2 (en) | 1988-04-13 | 1988-04-13 | Substrate for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0767001B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006005035A (en) * | 2004-06-16 | 2006-01-05 | Sumitomo Metal Electronics Devices Inc | Ceramic package assembly for storing electronic component and ceramic package |
| JP2007329318A (en) * | 2006-06-08 | 2007-12-20 | Hitachi Aic Inc | Substrate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5383545B2 (en) * | 2009-05-27 | 2014-01-08 | 京セラ株式会社 | Multi-cavity wiring board and wiring board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58123795A (en) * | 1982-01-19 | 1983-07-23 | アルプス電気株式会社 | Circuit board |
| JPS6021594A (en) * | 1983-07-15 | 1985-02-02 | 株式会社東芝 | Method of producing circuit board |
| JPS6046090A (en) * | 1983-08-24 | 1985-03-12 | シヤ−プ株式会社 | Electronic circuit board |
-
1988
- 1988-04-13 JP JP63088923A patent/JPH0767001B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58123795A (en) * | 1982-01-19 | 1983-07-23 | アルプス電気株式会社 | Circuit board |
| JPS6021594A (en) * | 1983-07-15 | 1985-02-02 | 株式会社東芝 | Method of producing circuit board |
| JPS6046090A (en) * | 1983-08-24 | 1985-03-12 | シヤ−プ株式会社 | Electronic circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006005035A (en) * | 2004-06-16 | 2006-01-05 | Sumitomo Metal Electronics Devices Inc | Ceramic package assembly for storing electronic component and ceramic package |
| JP2007329318A (en) * | 2006-06-08 | 2007-12-20 | Hitachi Aic Inc | Substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0767001B2 (en) | 1995-07-19 |
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