JPS6435937A - Semiconductor device - Google Patents

Abstract

PURPOSE:To make it possible to provide respectively through holes of the same width as a wiring width on fine wirings by a method wherein a first insulating layer having an aperture, a second insulating layer of a height equal almost with that of a first conducting layer for wiring and a second conducting layer for wiring, which is connected electrically with the first conducting layer through the aperture of the first insulating layer, are provided. CONSTITUTION:A wiring width at places, where are used as apertures (through holes) on wirings 10, is formed into the minimum processing dimension and an aperture of a first insulating film 5, which is larger by the amount of a mask alignment margin, is provided from the wiring 10. A second insulating film 30 is provided on the film 5 and its height is made equal with that of the wirings 10. Thereby, the wiring upper surface, which is not covered with the film 5, is exposed and an electrical connection with an upper wiring 20 can be obtained. Here, the film 30 exists on the side surfaces of the wirings at the through hole parts, the wiring upper surface only is exposed and the effective width of the through holes can be formed in the same width as the wiring width formed by processing in the minimum dimension.