JPS62134581A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS62134581A JPS62134581A JP60275436A JP27543685A JPS62134581A JP S62134581 A JPS62134581 A JP S62134581A JP 60275436 A JP60275436 A JP 60275436A JP 27543685 A JP27543685 A JP 27543685A JP S62134581 A JPS62134581 A JP S62134581A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- wiring
- holes
- board
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Tests Of Electronic Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は集積回路等の部品を実装するプリント基板に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed circuit board on which components such as integrated circuits are mounted.
従来この種のプリント基板は、集積回路等の部品を実装
させるプリント基板上にこれらの部品相互間を接続する
配線も同時に印刷されて作成されていた。Conventionally, this type of printed circuit board has been created by simultaneously printing wiring for interconnecting these components on a printed circuit board on which components such as integrated circuits are mounted.
上述した従来のプリント基板ではそのプリント基板上に
実装されている集積回路等の部品をインサーキットテス
ターで試験しよりとした時、各々の集積回路はプリント
基板の配線によって相互に接続されているためある特定
の集積回路を試験し。With the conventional printed circuit board mentioned above, when testing components such as integrated circuits mounted on the printed circuit board with an in-circuit tester, each integrated circuit is interconnected by the wiring on the printed circuit board. and test certain integrated circuits.
ようとしてインサーキットテスターのブローグビンよシ
ミ負信号を特定の集積回路に与えた時、その電気信号が
プリント基板の配線を伝わって他の集積回路にも流れて
いき、ラッチアップ、バックドライブ等の現象が生じ試
験不可能となるという欠点があった。When a negative signal is applied to a specific integrated circuit, the electrical signal travels through the wiring on the printed circuit board and flows to other integrated circuits, causing phenomena such as latch-up and backdrive. This had the disadvantage that the test was impossible.
本発明のプリント基板は集積回路等の部品を実装する部
品実装ホール、該部品実装ホールの夫々に1対1に対応
してその至近個所に設けられ、端子を実装する端子ホー
ル及び夫々1対1に対応する前記部品実装ホールと前記
端子ホールの相互間を接続する配fi1を有する部品基
板と、該部品基板に設けた前記端子ホールと夫々1対1
に対応した位置に前記端子ホールに実装される端子を挿
入・接続するスルーホール及び該スルーホールの相互間
を接続する配線を有する配線基板とを備えている。The printed circuit board of the present invention has component mounting holes for mounting components such as integrated circuits, and terminal holes for mounting terminals, which are provided in close proximity to each of the component mounting holes in one-to-one correspondence, and terminal holes for mounting terminals and one-to-one correspondence to each of the component mounting holes. A component board having a fi1 connecting the component mounting hole and the terminal hole corresponding to each other, and the terminal hole provided on the component board, respectively, in a one-to-one manner.
The terminal includes a through hole for inserting and connecting a terminal mounted in the terminal hole at a position corresponding to the terminal hole, and a wiring board having wiring for connecting the through holes to each other.
次に本発明の実施例について図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing one embodiment of the present invention.
第1図において本発明の一実施例は、部品基板11と配
線基板21とから構成される。部品基板11は集積回路
等の部品を実装する部品実装ホール12と端子を実装す
る端子ホール13と、これら両者を接続する配線14と
で構成されている。端子ホール13は部品実装ホール1
2と1対1に対応してその至近個所に設けられておシ配
線14はこの1対IK対応した部品実装ホール12と端
子ホール13とを相互に接続している。配線基板21は
部品基板11の端子ホール13と1対IK対応した位置
に設けたスルーホール22と、このスルーホールの間を
相互に接続する配線23とから構成されている。In FIG. 1, one embodiment of the present invention is comprised of a component board 11 and a wiring board 21. As shown in FIG. The component board 11 includes component mounting holes 12 for mounting components such as integrated circuits, terminal holes 13 for mounting terminals, and wiring 14 for connecting these two. Terminal hole 13 is component mounting hole 1
A wiring line 14 is provided in close proximity to the component mounting holes 12 and terminal holes 13 in one-to-one correspondence with each other, and interconnects the component mounting holes 12 and terminal holes 13 in one-to-one correspondence with each other. The wiring board 21 is composed of through holes 22 provided at positions corresponding to the terminal holes 13 of the component board 11 in a one-to-one IK correspondence, and wiring 23 interconnecting the through holes.
第2図及び第3図は本発明の一実施例の使用状態を示す
断面図である。第2図に示すように部品基板11には部
品実装ホール12に部品15が。FIGS. 2 and 3 are cross-sectional views showing one embodiment of the present invention in use. As shown in FIG. 2, a component 15 is mounted in a component mounting hole 12 on a component board 11.
更に端子ホール13には端子16が実装されるこれを第
3図に示すように端子16f、配線基板21の夫々対応
するスルーホール22に挿入して部品基板11と配線基
板21とを組合せて固定させる。Furthermore, the terminal 16 is mounted in the terminal hole 13. As shown in FIG. 3, the terminal 16f is inserted into the corresponding through hole 22 of the wiring board 21, and the component board 11 and the wiring board 21 are combined and fixed. let
端子16は第3図に示すように部品基板11と配線基板
21どを貫通し、夫々の配線面から若干突出する程度の
長さとしである。端子16とスルーホール22との接続
には半田付、溶剤の塗布、配線基板の導電性ゴム化、な
ど極々の方法があ)、これらは同時に部品基板11と配
線基板21の固定化の方法でもある。As shown in FIG. 3, the terminal 16 has such a length that it passes through the component board 11, the wiring board 21, etc., and slightly protrudes from the respective wiring surfaces. There are many methods for connecting the terminal 16 and the through hole 22, such as soldering, applying a solvent, and making the wiring board conductive rubber. be.
本実施例によれはインサーキットテストは第2図の部品
基板11に対して実施すれば部品相互間は接続されてい
ないので相互の干渉がなくなシ、従来のプリント基板の
問題点であったラッチアップ、バックドライブ等が発生
せず、インサーキットテストヲ支障な〈実施することが
可能になる。According to this embodiment, if the in-circuit test is performed on the component board 11 in FIG. 2, the components are not connected to each other, so there is no mutual interference, which was a problem with conventional printed circuit boards. Latch-up, backdrive, etc. do not occur, and in-circuit testing can be performed without any problems.
以上説明したように本発明は集積回路等の部品を実装す
る部品基板と、配線によシ相互に接続されたスルーホー
ルを有する配線基板とを組合せたプリント基板でインサ
ーキットテスターで試験する時は部品基板に部品を実装
した状態で行なうことによシ従来のプリント基板で発生
していたラッチアップ、バックドライブ等の現象を防止
し、インサーキットテストを支障な〈実施することがで
きるという効果が得られる。As explained above, when testing with an in-circuit tester the present invention is a printed circuit board that combines a component board on which components such as integrated circuits are mounted and a wiring board having through holes interconnected by wiring. By performing the test with the components mounted on the component board, phenomena such as latch-up and backdrive that occur with conventional printed circuit boards can be prevented, and in-circuit testing can be performed without any hindrance. can get.
第1図は本発明の一実施例を示す断面図、第2図及び第
3図は本発明の一実施例の使用状態を示す断面図である
。
11・・・部品基板、12・・・部品実装ホール、13
・・・端子ホール、14・・・配線、15・・・部品、
16・・・端子、21・・・配線基板、22・・・スル
ーホール、23・・・配線。
、+−+
代理人 弁理士 内 原 晋
゛ −−・FIG. 1 is a cross-sectional view showing an embodiment of the present invention, and FIGS. 2 and 3 are cross-sectional views showing how the embodiment of the present invention is used. 11... Component board, 12... Component mounting hole, 13
...terminal hole, 14...wiring, 15...parts,
16...Terminal, 21...Wiring board, 22...Through hole, 23...Wiring. ,+−+ Agent Patent Attorney Susumu Uchihara −−・
Claims (1)
装ホールの夫々に1対1に対応してその至近個所に設け
られ、端子を実装する端子ホール及び夫々1対1に対応
する前記部品実装ホールと前記端子ホールの相互間を接
続する配線を有する部品基板と、該部品基板に設けた前
記端子ホールと夫々1対1に対応した位置に前記端子ホ
ールに実装される端子を挿入・接続するスルーホール及
び該スルーホールの相互間を接続する配線を有する配線
基板とを備えたプリント基板であって、前記部品基板の
部品実装ホールに集積回路等の部品を、端子ホールに端
子を夫々実装し、前記端子を夫々対応する前記配線基板
のスルーホールに挿入・接続して前記部品基板と前記配
線基板とを組合せて固定させることにより集積回路等の
部品の実装及び部品相互間の配線を実現させるよりにし
たことを特徴とするプリント基板。Component mounting holes for mounting components such as integrated circuits, terminal holes for mounting terminals, and component mounting holes provided in close proximity to each of the component mounting holes in one-to-one correspondence; terminal holes for mounting terminals; A component board having wiring that connects the holes and the terminal holes, and terminals to be mounted in the terminal holes are inserted and connected to positions corresponding one-to-one to the terminal holes provided on the component board. A printed circuit board comprising through holes and a wiring board having wiring connecting between the through holes, wherein a component such as an integrated circuit is mounted in the component mounting hole of the component board, and a terminal is mounted in the terminal hole. , by inserting and connecting the terminals to the corresponding through holes of the wiring board and fixing the component board and the wiring board in combination, mounting of components such as integrated circuits and wiring between the components are realized. A printed circuit board that is characterized by being made of aluminum.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60275436A JPS62134581A (en) | 1985-12-06 | 1985-12-06 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60275436A JPS62134581A (en) | 1985-12-06 | 1985-12-06 | Printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62134581A true JPS62134581A (en) | 1987-06-17 |
Family
ID=17555489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60275436A Pending JPS62134581A (en) | 1985-12-06 | 1985-12-06 | Printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62134581A (en) |
-
1985
- 1985-12-06 JP JP60275436A patent/JPS62134581A/en active Pending
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