JPH0126177B2 - - Google Patents
Info
- Publication number
- JPH0126177B2 JPH0126177B2 JP59203009A JP20300984A JPH0126177B2 JP H0126177 B2 JPH0126177 B2 JP H0126177B2 JP 59203009 A JP59203009 A JP 59203009A JP 20300984 A JP20300984 A JP 20300984A JP H0126177 B2 JPH0126177 B2 JP H0126177B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- leads
- jig
- sides
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/048—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59203009A JPS6182451A (ja) | 1984-09-29 | 1984-09-29 | Icパツケ−ジのリ−ド曲げ加工方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59203009A JPS6182451A (ja) | 1984-09-29 | 1984-09-29 | Icパツケ−ジのリ−ド曲げ加工方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6182451A JPS6182451A (ja) | 1986-04-26 |
| JPH0126177B2 true JPH0126177B2 (cg-RX-API-DMAC10.html) | 1989-05-22 |
Family
ID=16466820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59203009A Granted JPS6182451A (ja) | 1984-09-29 | 1984-09-29 | Icパツケ−ジのリ−ド曲げ加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6182451A (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06204376A (ja) * | 1992-10-17 | 1994-07-22 | M Tex Matsumura Kk | 電子部品のリード修正方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS509267A (cg-RX-API-DMAC10.html) * | 1973-05-30 | 1975-01-30 | ||
| JPS5612398A (en) * | 1979-07-11 | 1981-02-06 | Kumiai Chem Ind Co Ltd | Organic phosphate derivative, its preparation, and germicide, insecticide and acaricide containing it |
| JPS5828740A (ja) * | 1981-08-13 | 1983-02-19 | Mitsubishi Paper Mills Ltd | ハロゲン化銀写真材料の製造方法 |
| JPS6331408U (cg-RX-API-DMAC10.html) * | 1986-08-18 | 1988-03-01 | ||
| JPS6426177A (en) * | 1987-07-22 | 1989-01-27 | Furuno Electric Co | Measured position display device |
-
1984
- 1984-09-29 JP JP59203009A patent/JPS6182451A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6182451A (ja) | 1986-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH06232305A (ja) | リ−ドフレ−ムの製造方法 | |
| JPH0126177B2 (cg-RX-API-DMAC10.html) | ||
| US5012664A (en) | Progressive form die | |
| KR101321190B1 (ko) | Mosfet bga용 절곡 프레임 캐리어 | |
| US4600611A (en) | Film carrier for manufacturing semiconductor devices | |
| US20080245470A1 (en) | System and method for improved auto-boating | |
| CN218473509U (zh) | 一种用于防基板翘曲的压平机构及芯片封装机 | |
| US6016852A (en) | Leaded grid array IC package having coplanar bent leads for surface mount technology | |
| JPH01115150A (ja) | 電子部品のリードの平面性を保持する方法 | |
| JPS62257787A (ja) | モジユ−ルプリント板の多数個取り方法 | |
| JPH0430186B2 (cg-RX-API-DMAC10.html) | ||
| JPH0828453B2 (ja) | 半導体装置のリード成形方法 | |
| JPH0691131B2 (ja) | フィルムキャリァ | |
| JPH0322924Y2 (cg-RX-API-DMAC10.html) | ||
| JPS6123653B2 (cg-RX-API-DMAC10.html) | ||
| JPH02248057A (ja) | テープボンディング装置 | |
| JP2673124B2 (ja) | Ilbテープのアウターリードのカットフォーミング装置及び該装置によるカットフォーミング方法 | |
| JPH07106798A (ja) | 部品端子の曲がり矯正方法 | |
| JPH05326789A (ja) | 半導体装置のアウターリードの折り曲げ加工方法及びその装置 | |
| JPS5850762A (ja) | 半導体装置用リ−ドフレ−ム | |
| JPH088323B2 (ja) | 多面付チップキャリア基板のプッシュバック工法 | |
| JPH06224351A (ja) | 半導体装置のリード加工装置とその加工方法 | |
| JPS60251070A (ja) | 電子部品等の整列用トレイ | |
| JPH09293650A (ja) | チップ部品の電極形成装置 | |
| JPS6046059A (ja) | リ−ド・フレ−ム |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |