JPH0126167B2 - - Google Patents
Info
- Publication number
- JPH0126167B2 JPH0126167B2 JP11498481A JP11498481A JPH0126167B2 JP H0126167 B2 JPH0126167 B2 JP H0126167B2 JP 11498481 A JP11498481 A JP 11498481A JP 11498481 A JP11498481 A JP 11498481A JP H0126167 B2 JPH0126167 B2 JP H0126167B2
- Authority
- JP
- Japan
- Prior art keywords
- coil
- coil device
- plate
- shaped lead
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 23
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 22
- 239000003990 capacitor Substances 0.000 claims description 15
- 239000002131 composite material Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000004804 winding Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 41
- 239000006071 cream Substances 0.000 description 15
- 238000005476 soldering Methods 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000007639 printing Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004838 Heat curing adhesive Substances 0.000 description 1
- 238000003854 Surface Print Methods 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11498481A JPS5815223A (ja) | 1981-07-21 | 1981-07-21 | 複合型回路部品及び製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11498481A JPS5815223A (ja) | 1981-07-21 | 1981-07-21 | 複合型回路部品及び製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5815223A JPS5815223A (ja) | 1983-01-28 |
| JPH0126167B2 true JPH0126167B2 (es) | 1989-05-22 |
Family
ID=14651466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11498481A Granted JPS5815223A (ja) | 1981-07-21 | 1981-07-21 | 複合型回路部品及び製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5815223A (es) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6195774A (ja) * | 1984-10-17 | 1986-05-14 | Kobe Steel Ltd | 溶接電源の出力制御方法 |
| US4866247A (en) * | 1986-12-11 | 1989-09-12 | The Lincoln Electric Company | Apparatus and method of short circuiting arc welding |
-
1981
- 1981-07-21 JP JP11498481A patent/JPS5815223A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5815223A (ja) | 1983-01-28 |
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