JPH0126167B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite circuit component including a coil L, a capacitor C, etc., and a method for manufacturing the same.

For example, a plurality of coils L ₁ ~ as shown in FIG.
A conventional device for constructing an LC filter consisting of L ₄ and capacitors C ₁ to C ₈ on a single substrate is shown in FIG. 2. this is,
A plurality of front surface electrodes 12 are printed on the surface of a rectangular dielectric substrate 11, and a first back surface electrode 12A' having a large area corresponding to the plurality of surface electrodes 12 and a small second surface electrode are printed on the back surface thereof. Coil devices 13 to 16 are formed by printing a back electrode 12B' and winding coils _L1 to _L4 around a drum-shaped core in four recesses 18 formed on one side of the dielectric substrate 11, respectively. Coil terminals 1 pulled out from each coil device 13 to 16 after being fitted and arranged
9A and intermediate taps 19B are provided on the other side of the dielectric substrate 11, respectively.
A, the contact portions of the coil terminal 19A and intermediate tap 19B and each surface electrode 12 are electrically connected by soldering or the like, and one of the surface electrodes 12 is
Lead wires 10A to 10C are connected to two back electrodes 12A' and 12B' by soldering or the like. Here, the opposing portions of the front electrode 12 and the back electrodes 12A' and 12B' are respectively configured as capacitors _C1 to _C8 .

However, in the above device, the height dimension l ₁₁ of the large-area back electrode 12A' to ensure the capacitance of the capacitor and the height dimension l ₁₂ necessary to fixedly support the coil devices 13 to 16 are limited. Therefore, the height dimension _l13 of the dielectric substrate 11 becomes extremely large, which poses a problem of hindering miniaturization of composite circuit components.
In addition, as the height dimension increases, the coil devices 13 to 1
The length of the coil terminal 19A and the intermediate tap 19B that are pulled out from the coil end 19A also increases, which causes problems such as wire breakage during assembly work. Furthermore, a protrusion 1 for wrapping the coil terminal 19A, etc.
1A also increases as the number of elements increases, resulting in the inconvenience of frequent breakage accidents, or the inconvenience of having a plurality of recesses 18 and the protrusions 11A with a predetermined interval maintained on both sides of the dielectric substrate 11. The necessity of separately providing these leads to various inconveniences, such as complicating the manufacturing process, increasing the number of man-hours, and even causing connection failures.

The present invention has been made in view of the above circumstances, and it is possible to reduce the size and improve the packaging density, and
It is an object of the present invention to provide a composite circuit component and a method for manufacturing the same that can simplify the manufacturing process and reduce the number of man-hours.

The present invention will be specifically explained below using Examples.

FIG. 3 is a perspective view showing an embodiment of the composite circuit component of the present invention. In the figure, reference numeral 1 denotes a rectangular dielectric substrate, and a plurality of surface electrodes 2A ₁ to 2A ₈ are formed on the surface of this dielectric substrate 1. As shown in FIG. Among these surface electrodes, the inverted L-shaped electrodes 2A ₁ and 2 at both ends
A ₅ and the intermediate T-shaped electrodes 2A ₂ to 2A ₄ are coil device connection electrodes and capacitor electrodes, and the remaining three electrodes 2A ₆ to 2A ₈ are intermediate tap connection electrodes and capacitor electrodes. Become. In particular, the second electrode _2A4 from the right end in the figure reaches the lower side of the dielectric substrate 1, and a notch 7e of an appropriate shape (the one shown is V-shaped) is provided on that side. It is electrically connected to a capacitor electrode on the back surface, which will be described later, via a conductive layer formed on the end face of the notch. Here, other V-shaped notches 7a to 7d and 7f are provided on the lower side of the dielectric substrate 1, but no dielectric layer is formed on the end surfaces of these. The plurality of coil device connection electrodes 2A ₁ ~
Coil devices 3 to 6 each having a coil wound around a drum-shaped core are mounted between 2A _{and 5} . Each of the coil devices 3 to 6 has a recess formed in the end face of both end flanges, and each coil terminal 3A to 6A is pulled out to the dielectric layer 3B to 6B provided in the recess. A standing leg is placed on each of the electrodes 2A ₁ to 2A ₅ via plate-shaped lead wires 3C to 6C attached so as to be pressed from the outside,
The coil terminals 3A to 6A and each electrode 2A ₁ to 2A ₅ are electrically connected to each other by soldering or the like via the plate-shaped lead wires 3C to 6C. Further, among these coil devices, three coil devices 3 to 5 have coils wound around a drum-shaped core with three flanges, and intermediate taps 3D to 5D are respectively led out and connected to the electrodes for connecting the intermediate taps. It is connected to 2A ₆ to _{2A 8} by soldering or the like. External connection lead wires 10A and 10C are connected to the electrodes 2A ₁ and 2A ₅ at both ends of the dielectric substrate 1, respectively.
Lead wires 10B for external connection are electrically connected to common electrodes for capacitors, which will be described later, formed on the back surface of the LC coupling filter as shown in FIG. There is. Note that the tips of the external lead wires 10A to 10C, which contact the substrate, are each pressed into a plate shape.

Next, the specific structure and manufacturing method of each part of the device will be specifically explained with reference to FIGS. 4 to 14.

First, an example of the process for obtaining each of the coil devices 3 to 6 will be explained. 4a and 5b and 5a and 5b show the device main body 6',
This shows the 3' stage. The following will be explained in order.

First, as shown in FIGS. 4a and 4b, a drum-shaped core 6F with circular recesses 6E, 6E formed on the end faces of both end flanges was prepared, and a thermosetting adhesive, for example, was applied to the curved surfaces of the recesses. Thereafter, a copper foil 6B cut into an appropriate shape (circular shape) is attached to the adhesive surface, and the copper foil 6B is fixed by heating at an appropriate temperature. After that, the coil is wound around the core 6F a predetermined number of times, and the coil terminals 6A, 6A are pulled out and bent at the end face of the flange, and then the copper foils 6B, 6B are bent.
Place it in contact with the top.

As shown in FIGS. 5a and 5b, the three-piece coil device main body 3' has concave portions 3E, 3E similar to the two-piece coil device, and copper foil 3B,
3B, and place the coil terminals 3A, 3A pulled out on both end faces, on the copper foils 3B, 3B, and further pull out the intermediate tap 3D of the wound coil downward and twist it in a figure 8 shape. .

Next, a clip-shaped lead wire member 8' having an open free end as shown in FIGS. 6a and 6b is prepared,
By pressing and dipping the open free end portions that stand side by side, they are formed into a plate shape, thereby creating two plate-shaped lead portions 8 that face each other. Then, both base end portions 8B, 8
B mutually inwardly and both tip portions 8
A and 8A are further bent inward toward each other. At this time, it is important to form the bent end portion 8A in a shape that curves along the curved surface of the recessed portion (6E, 6E in FIGS. 5 and 6) of the coil devices 3 to 6. This clip-shaped lead wire member 8' is handled by being sandwiched between an insulating sheet 9A and an adhesive sheet 9B for convenient transportation, and both sheets have sprocket holes 9C for transportation. It is provided. This clip-shaped lead wire member 8' is made of an elastic metal material,
It is provided with a spring action itself and is bonded to the sheets 9A, 9B, thereby increasing its elasticity.

After preparing such a lead wire member 8', a coil device is prepared in which a coil is wound around the drum-shaped core obtained in the above step between the plate-shaped lead wire 8 portions as shown in FIGS. 7a and 7b. Hold 6'. At this time, the pair of curved tips 8A, 8A are brought into contact along the copper foil 6B adhered to the recess 6E on both end faces of the flange of the coil device 6'. As a result, the spring action of the clip-shaped lead wire member 8' acts to press inward the pair of curved tips 8A, 8A that are in contact with both ends of the coil device 6'. 6' will be securely clamped.

Thereafter, as described above, the coil device 6' is held upside down by the tip ends 8A, 8A of the plate-shaped lead wires 8, and only the held parts are immersed in a solder bath for a predetermined period of time to perform soldering. (Dip Handa).
High-temperature solder is used at this time to prevent the plate-shaped lead wire from coming off the end face of the drum in the subsequent process. As a result, the coil terminal 6A and the plate-shaped lead wire 8 are reliably electrically connected via the copper foil 6B in the recesses 6E formed in the end faces of the flanges at both ends of the coil device 10. Note that the soldering method is not limited to the solder dip method, but may also be a jet method in which solder is sprayed from both sides.

At this stage, the proximal end connection part of the clip-shaped lead wire member is separated and various characteristics are tested and measured.
The coil device 6 having two flanges is obtained by cutting at or near the position B and removing unnecessary parts. The other coil devices 3 to 5 are manufactured by almost the same process, but the preliminary soldering process for the tip of the intermediate tap is performed separately.

Next, an embodiment in which electrodes are formed on the front and back sides of the dielectric substrate 1 will be described with reference to FIGS. 9 and 10.

As shown in FIG. 9, electrodes 2A ₁ and 2A ₅ having an approximately inverted L shape are formed at both ends of the surface of the dielectric substrate 1, and approximately T is provided with a predetermined interval between these two electrodes.
Forming three electrodes 2A ₂ to 2A ₄ exhibiting a letter shape,
Furthermore, there are three intermediate tap connection electrodes 2 between each electrode.
A ₆ to 2A ₈ are formed. Here, 2
The lower part of the T-shaped electrode _2A4 is formed to extend to reach the lower side of the substrate 1, and a V-shaped notch 7e is provided at the intersection thereof. Other notches 7a to 7d and 7f are simultaneously formed on the lower side of this substrate, and a conductive layer communicating with the back surface is provided on the end face of the notch 7e. Further, on the back surface of this dielectric substrate 1, a large-area capacitor electrode 2B ₁ and a small-area capacitor electrode 2B ₂ are formed. Among these, the lower end of the small-area capacitor electrode _2B2 in the figure is formed to extend to the V-shaped notch 7e on the lower side of the substrate, and the conductive layer provided on the end face of the notch 7e is connected to the surface. It should be electrically connected to electrode _2A4 .
Each of the electrodes can be formed using various methods, such as partially silver plating through a screen or partially printing a conductive layer.

A solder layer 21 as shown in FIG.
is prepared for the next step. This solder layer 21 is, for example, paste solder (solder cream).
is formed by coating the entire surface of the dielectric substrate 1, including the entire surface of each electrode (full surface printing method),
An example of the composition of the solder cream in this case is 2
It is preferable to use a material containing approximately 10% silver, approximately 10% flux material, and approximately 63% tin. still,
The lower end of the front electrode 2A ₄ and the lower end of the back electrode 2B ₂ connected to the V-shaped notch 7e on the lower side of the substrate 1 are connected before the solder layer 21 is formed. The solder layer 21 is not formed in that portion. This is to prevent the connection electrode from being eaten by solder and to improve reliability.

Next, an embodiment of the external connection lead wires 10A to 10C will be described with reference to FIGS. 11a and 11b. The external connection lead wires 10A to 10C are connected to an insulating sheet 22A and an adhesive sheet 22B at appropriate intervals.
After adhering and fixing between the conveying sheets 22 consisting of, the protruding tips are pressed and dipped using a jig to form the plate-like tips 10a to 10c, and the base of the plate-like tips is slightly bent. . Then, the plate-shaped tip 10a
Apply preliminary solder to ~10c. Incidentally, a sprocket hole 22C is provided along the longitudinal direction in the intermediate portion of the conveying sheet 22 to facilitate conveyance during automatic assembly.

Thereafter, as shown in FIG. 12, the dielectric substrate 1 is coated with solder cream on the entire surface as described above.
are held between the external lead wires 10A to 10C. At this time, the external connection lead wires 1 on both ends
The plate-shaped tips 10a and 10c of 0A and 10C are in contact with the solder layer on both end electrodes 2A ₁ and 2A ₅ on the front surface, respectively, and the plate-shaped tip 10b of the central external connection lead wire 10B is in contact with the capacitor electrode on the back side. 2B Place and hold it so that it contacts the solder layer on ₁ .

Thereafter, as shown in FIG. 13, each of the coil devices 3 to 6 is mounted on the coil device connection solder layer via plate-shaped lead wires 3C to 6C attached to both end surfaces of each coil device. Perform soldering. At this time, each coil device is lightly fixed by the solder cream, so that it will not fall off even if the entire device is tilted or a slight impact is applied.

Soldering is performed as follows. That is, as described above, the dielectric substrate 1, which is held by the external connection lead wires 10A to 10C and on which the coil devices 3 to 6 are mounted via the solder layer 21, is held in a substantially horizontal state and heated, for example. Using a plate heating method,
Gradually increase the heating temperature. In this case, the heating conditions are preheating for the first 30 seconds, and heating for the last 3 to 30 seconds.
It is desirable that the main heating is performed at a constant temperature for about 5 seconds. At this time, the external connection lead wire 10B is soldered to the electrode by melting the solder pre-soldered in advance. Further, the lead wires 10A and 10C for external connection are soldered to the electrodes by simultaneously melting the pre-solder and simultaneously melting the solder cream.

Due to the above heating, the solder cream applied to the entire surface of the dielectric substrate 1 in the above step is concentrated on the electrode portions. That is, as shown in FIG. 14, for example, there is a large amount of metal on the mounting surface of the plate-shaped lead wires _6C , 6C at both ends of the coil device 6, which is placed between the electrodes _2A 4 and 2A 5 on the substrate 1. The solder 21 concentrates and swells up, and furthermore, the plate-shaped lead wires 6C, 6C
Since the solder also rides onto the gap between the coil device and the end face of the coil device due to capillary action, the electrical connection is ensured. Similarly, the connections between the plate-like lead wires and electrodes of other coil devices, the connections between the intermediate taps and the electrodes, and the connections between the external connection lead wires and the electrodes are reliably performed. In this way, a composite circuit component as shown in FIG. 3 is assembled.

The present invention is not limited to the embodiments described above, and various modifications are possible. For example, in the above embodiment, the connection between the coil device and the electrode and the connection between the external connection lead wire and the electrode were explained after printing solder cream on the entire surface, but the method also involves applying solder cream locally. (local printing method) may also be used. That is, as shown in FIG. 15, for example, after placing a partially opened screen,
Using this as a mask, paste solder (solder cream) is applied to the coil device connection solder layer 21A.
~21D, solder layer for external lead wire connection 21E, 2
Forms 1F. In this case, the method of applying the solder cream may be either a method of locally squirting it through a screen (a method using a dispenser), or a method of locally ejecting the solder cream through a screen. Furthermore, among the respective solder layers,
21A is formed to include the opposing ends of the electrodes 2A ₁ and 2A ₂ and the upper end of the intermediate tap connection electrode 2A ₆ ;
21B is formed to include the opposing ends of the electrodes 2A ₂ and 2A ₃ and the upper end of the intermediate tap connection electrode 2A ₇ ;
21C is formed to include the opposing ends of the electrodes _2A3 and _2A4 and the upper end of the intermediate tap connection electrode _2A8 . Needless to say, at this time, it is necessary to align the screen (mask) with the window opened (mask alignment).

Thereafter, as shown in FIG. 16, the dielectric substrate 1 to which solder cream has been applied locally is held between the external connection lead wires 10A to 10C.
The coil devices 3 to 6 are mounted between the electrodes, and soldered by heating as described above. As a result, the various parts are reliably connected as in the case described above.

Furthermore, although the soldering described above was performed using a cream soldering method, it is also possible to use a full-surface solder dip method. In this case, in the process of applying the solder cream mentioned above, heat-curing adhesive is applied instead of solder cream to the end of the electrode for mounting the coil device, and the coil device is mounted on that part and the lead for external connection is applied. After clamping the wire, the coil device is preheated to harden the adhesive to temporarily fix the coil device, and then the entire device is turned upside down, immersed in a solder bath for a predetermined period of time, and then cooled. You can get the same effect as in the case.

Incidentally, in the above embodiment, a coil device using a drum-shaped core was shown, but in addition to this, it is possible to use a core of any shape, such as a square core or a pot-shaped core. Needless to say, it can be used even if there is a problem.

According to the present invention described in detail above, the coil device can be easily mounted and connected to the upper side of the surface of the dielectric substrate. Since it is sufficient to ensure the width of the drum core, a significantly smaller area is sufficient compared to the case of providing a fitting recess for inserting the entire cross section of the drum-shaped core as in conventional devices, and the dimension in the height direction can be shortened. This makes it possible to downsize the device. In addition, there is no need for a recess for fitting the coil device or a protrusion for connecting the coil terminals, and the coil terminals can be extremely short, preventing breakage or disconnection accidents. Since the connections are made reliably, highly reliable products can be provided. Furthermore, the soldering work becomes extremely easy and automatic soldering becomes possible, which brings about excellent effects such as simplification of manufacturing and reduction of man-hours.

[Brief explanation of drawings]

Fig. 1 is a circuit diagram of the LC composite filter, Fig. 2 is a front view of a conventional device in which it is made into a composite component, Fig. 3 is a perspective view showing an embodiment of the composite type circuit component of the present invention, and Figs. FIG. 14 is a diagram for explaining an example of the specific configuration of the embodiment device and the manufacturing method thereof in the order of steps, FIGS. 4a and 4b are sectional views and side views of the coil device main body, and FIG. , b are a sectional view and a side view of another coil device main body, FIGS. 6 a and b are a front view and a side view of the plate-shaped lead wire, and FIGS. 7 a and b
8 is a cross-sectional view and a side view showing the coil device main body held between plate-shaped lead wires, FIG. Surface view, Figure 10 is a surface view of a solder layer formed on a dielectric substrate, Figure 11 a, b
12 is a front view and a side view showing an example of an external connection lead wire, FIG. 12 is a front view showing the state of connection between the board and the external connection lead wire, and FIG. 13 is a state in which the coil device is mounted on the board. A front view, FIG. 14 is a sectional view showing a soldered state, and FIGS. 15 and 16 are front views for explaining electrical connections using other soldering methods. 1...Dielectric substrate, _2A1 to _2A8 , _2B1 , _2B2 ...
Electrode, 3-6... Coil device, 3A-6A... Coil terminal, 3B-6B... Conductive layer, 3C-6C... Plate lead wire, 3D-5D... Intermediate tap, 3E-6E...
Recessed portion, 7a to 7f...notch portion, 8'...lead wire member,
9, 22... Sheet for conveyance, 10A to 10C... Lead wires for external connection, 21, 21A to 21H... Solder layer.

Claims (1)

[Claims] 1. A dielectric substrate on which a coil device connection electrode and a capacitor electrode are formed, and a capacitor electrode formed on the back surface, and mounted on the coil device connection electrode on the surface of the dielectric substrate. The coil device is composed of a connected coil device and a lead wire for external connection, and the coil device has a conductive layer formed on both end surfaces of a core formed by winding a coil, and a coil terminal placed on the conductive layer is sandwiched between the coil devices. A composite circuit component, characterized in that the composite circuit component is mounted and connected to a substrate via a plate-shaped lead wire that is disposed along the conductive layer and whose end portion is erected on the coil device connection electrode. 2. At least a step of winding a coil around a core having a conductive layer formed on both end faces and pulling out the coil end onto the conductive layer to obtain a coil device body, and a clip-shaped lead wire having plate-shaped lead portions facing each other. A step of sandwiching the coil device main body between opposing plate-shaped lead parts of the member and electrically connecting the plate-shaped lead part and the coil terminal, and a step of connecting the lead wire with the plate-shaped lead part connected to the coil device remaining. a step of cutting a member; a step of mounting a plate-shaped lead portion of the coil device on the coil device connection electrode of a dielectric substrate on which a coil device connection electrode and a capacitor electrode are formed on the front and back surfaces; A method for manufacturing a composite circuit component, comprising the step of electrically connecting a plate-shaped lead portion and a coil device connection electrode.