JPH0125388B2 - - Google Patents

Info

Publication number
JPH0125388B2
JPH0125388B2 JP1873587A JP1873587A JPH0125388B2 JP H0125388 B2 JPH0125388 B2 JP H0125388B2 JP 1873587 A JP1873587 A JP 1873587A JP 1873587 A JP1873587 A JP 1873587A JP H0125388 B2 JPH0125388 B2 JP H0125388B2
Authority
JP
Japan
Prior art keywords
copper foil
copper
electrolytic plating
substrate
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1873587A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63186888A (ja
Inventor
Takeshi Kanda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiko Electronics Co Ltd
Original Assignee
Meiko Denshi Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiko Denshi Kogyo Co Ltd filed Critical Meiko Denshi Kogyo Co Ltd
Priority to JP1873587A priority Critical patent/JPS63186888A/ja
Publication of JPS63186888A publication Critical patent/JPS63186888A/ja
Publication of JPH0125388B2 publication Critical patent/JPH0125388B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
JP1873587A 1987-01-30 1987-01-30 銅箔の製造方法 Granted JPS63186888A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1873587A JPS63186888A (ja) 1987-01-30 1987-01-30 銅箔の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1873587A JPS63186888A (ja) 1987-01-30 1987-01-30 銅箔の製造方法

Publications (2)

Publication Number Publication Date
JPS63186888A JPS63186888A (ja) 1988-08-02
JPH0125388B2 true JPH0125388B2 (OSRAM) 1989-05-17

Family

ID=11979926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1873587A Granted JPS63186888A (ja) 1987-01-30 1987-01-30 銅箔の製造方法

Country Status (1)

Country Link
JP (1) JPS63186888A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3262558B2 (ja) * 1998-09-14 2002-03-04 三井金属鉱業株式会社 多孔質銅箔およびその用途ならびにその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100974373B1 (ko) * 2008-02-28 2010-08-05 엘에스엠트론 주식회사 인쇄회로용 동박의 표면처리 방법과 그 동박 및 도금장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3262558B2 (ja) * 1998-09-14 2002-03-04 三井金属鉱業株式会社 多孔質銅箔およびその用途ならびにその製造方法

Also Published As

Publication number Publication date
JPS63186888A (ja) 1988-08-02

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