JPS63186888A - 銅箔の製造方法 - Google Patents
銅箔の製造方法Info
- Publication number
- JPS63186888A JPS63186888A JP1873587A JP1873587A JPS63186888A JP S63186888 A JPS63186888 A JP S63186888A JP 1873587 A JP1873587 A JP 1873587A JP 1873587 A JP1873587 A JP 1873587A JP S63186888 A JPS63186888 A JP S63186888A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- copper
- substrate
- foil layer
- flow rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 65
- 239000011889 copper foil Substances 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000009713 electroplating Methods 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000007788 roughening Methods 0.000 claims abstract description 15
- 239000003792 electrolyte Substances 0.000 claims abstract description 10
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 7
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 239000008151 electrolyte solution Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 239000002244 precipitate Substances 0.000 claims description 12
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 21
- 230000006866 deterioration Effects 0.000 abstract description 4
- 239000011888 foil Substances 0.000 abstract description 2
- 238000007747 plating Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 235000021186 dishes Nutrition 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1873587A JPS63186888A (ja) | 1987-01-30 | 1987-01-30 | 銅箔の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1873587A JPS63186888A (ja) | 1987-01-30 | 1987-01-30 | 銅箔の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63186888A true JPS63186888A (ja) | 1988-08-02 |
| JPH0125388B2 JPH0125388B2 (OSRAM) | 1989-05-17 |
Family
ID=11979926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1873587A Granted JPS63186888A (ja) | 1987-01-30 | 1987-01-30 | 銅箔の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63186888A (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009206514A (ja) * | 2008-02-28 | 2009-09-10 | Ls Mtron Ltd | プリント回路用銅箔及びその表面処理方法、並びにメッキ装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1184359C (zh) * | 1998-09-14 | 2005-01-12 | 三井金属鉱业株式会社 | 多孔铜箔及其用途和制造方法 |
-
1987
- 1987-01-30 JP JP1873587A patent/JPS63186888A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009206514A (ja) * | 2008-02-28 | 2009-09-10 | Ls Mtron Ltd | プリント回路用銅箔及びその表面処理方法、並びにメッキ装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0125388B2 (OSRAM) | 1989-05-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |