JPH01251619A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPH01251619A
JPH01251619A JP7946088A JP7946088A JPH01251619A JP H01251619 A JPH01251619 A JP H01251619A JP 7946088 A JP7946088 A JP 7946088A JP 7946088 A JP7946088 A JP 7946088A JP H01251619 A JPH01251619 A JP H01251619A
Authority
JP
Japan
Prior art keywords
etching
type semiconductor
layer
substrate
interconnections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7946088A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0450737B2 (enExample
Inventor
Keizo Yamada
恵三 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP7946088A priority Critical patent/JPH01251619A/ja
Publication of JPH01251619A publication Critical patent/JPH01251619A/ja
Publication of JPH0450737B2 publication Critical patent/JPH0450737B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
JP7946088A 1988-03-30 1988-03-30 半導体装置の製造方法 Granted JPH01251619A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7946088A JPH01251619A (ja) 1988-03-30 1988-03-30 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7946088A JPH01251619A (ja) 1988-03-30 1988-03-30 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH01251619A true JPH01251619A (ja) 1989-10-06
JPH0450737B2 JPH0450737B2 (enExample) 1992-08-17

Family

ID=13690491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7946088A Granted JPH01251619A (ja) 1988-03-30 1988-03-30 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH01251619A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5508038A (en) * 1990-04-16 1996-04-16 Alza Corporation Polyisobutylene adhesives for transdermal devices

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101873583B1 (ko) * 2011-01-12 2018-07-03 동우 화인켐 주식회사 액정표시장치용 어레이 기판의 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5508038A (en) * 1990-04-16 1996-04-16 Alza Corporation Polyisobutylene adhesives for transdermal devices

Also Published As

Publication number Publication date
JPH0450737B2 (enExample) 1992-08-17

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